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3Dresyn TCR-Fluorosilicone1, Temperature and Chemical Resistant Fluorosilicone

Regular price 1,350.00 €

Shipping calculated at checkout.

3Dresyn TCR-Fluorosilicone1 has these features and benefits:

  • Temperature and Chemical Resistant Fluorosilicone
  • UV & EB curable silicone soft and elastic photopolymer for nano and micro fabrication (photolithography and softlithography), such as printing of soft and elastic stamps for Nano Imprinting lithography NIL and for soft & elastic negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
  • excellent chemical resistance to fuels and oils 
  • UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
  • Electron beam EB curable
  • compatible and blendable with our 3Dreyns for nano & micro fabrication  
  • 100% foldable without breaking
  • synthetic resin source
  • Shore Hardness A20-40 range
  • medium tensile strength, <3 MPa
  • medium soft and elastic (Young modulus <7 MPa)
  • elongation at yield >100%
  • refractive index 1.35-1.4
  • durable
  • medium viscosity <6000 mPas
  • excellent balance of low viscosity for easy imprinting and low penetration  
  • very high resolution (printing resolution of less than 10 nm)
  • very low shrinkage <0.1%
  • printable by most commercial and professional SLA, DLP & LCD 3D printers
  • organo-tin free
  • high optical clarity
  • high durability
  • excellent bonding, low risk of debonding
  • imprint Temperature 160ºC or higher 
  • very low degassing at high vacuum 
  • low oxygen sensitivity
  • high mechanical stability
  • long shelf life of 1 year
  • excellent spin coating application 
  • excellent etching with Reactive Ion Etching
  • superior stability and chemical resistance to a wide range of wet chemistries used in the clean room
  • low penetration
  • low surface tension with good release and demolding properties
  • 100% organic (free of inorganic materials) 
  • contains Fluorine functionality
  • no thermal treatment is required
  • easy processing with standard lithography equipment
  • easy removal of uncured resin with ketones, alcohols and esters


  • UV curable molds for soft lithography
  • LED lighting encapsulation
  • power supplies
  • sensors
  • connectors
  • transformers
  • amplifiers
  • industrial controls
  • high voltage resistors
  • relays
  • adhesive/encapsulant for solar cells
  • photocurable adhesive for integrated circuits during processing
  • cost effective transparent stamp fabrication, alternative to quartz stamps
  • ideal for mass sensors based on UV-NIL, ALD and RIE

Note: this resin exhibits similar chemical resistance to conventional fluorosilicones. it is made to order and its delivery time is around 2-3 weeks after ordering.