
- sintering/curing T=120-200ºC (the higher the sintering temperature the lower the resistivity) for 5-10 minutes after 3D printing
- Resistivity <30 μΩ·cm or microohm centimeter (or 30×10−8 Ω·m) when used in dip coatings
- Resistivity will increase proportionally to its dilution in 3D resins up to 10−2 -10+13 Ω·m*
Features of 3D-ADD EK1*:
- excellent compatibility with most SLA DLP and LCD 3Dresins
- excellent conductivity with our conductive binders: 3Dresyn SEK1 and 3Dresyn NSEK1
- dosage of 3D ADD EK1 can be adjusted to wish
- excellent conductivity with Resistivity <30 microohm centimeter when used pure or diluted with our Conductive Thinner CT1 (included and supplied with 3D-ADD EK1) by dip coatings
- ideal for dipping 3D prints in 3D-ADD EK1 for cost effectiveness since 3D-ADD EK1 will be on the surface of the 3D printed device.
- adjust the viscosity of 3D-ADD- EK1 with our Conductive Thinner CT1 to control the rheology and the thickness of the 3D-ADD EK1 to wish when dipping the 3D printed parts inside it
- 3D-ADD EK1 has excellent adhesion on the surface of most 3Dresyns
- high conductivity when used in dip coatings: Resistivity <30 microohm centimeter
- low sintering/curing T=120-150-200ºC for 5-10 minutes
*Note: conductivity of 3D printed parts will depend on several variables, such as % 3D-ADD EK1, the 3D resin, dosage of Fine Tuner FT1 and LB1 Bio and the sintering/curing cycle used. LCD 3D printers may exhibit printability limitations at high dosage of 3D-ADD EK1, due to their low light power . It is highly recommended to apply 3D-ADD EK1 to our 3Dresyn SEK1 and/or NSEK1 or by dipping 3D printed parts diluted to wish with our Conductive Thinner CT1