3Dresyn NMF-T1 Tough photopolymer for nano and micro fabrication

3Dresyn NMF-T1 has these features and benefits:

• UV & EB curable organic tough photopolymer for nano and micro fabrication, such as printing of tough stamps for Nano Imprinting lithography NIL and for tough negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
• resin with properties in between quartz glass and PDMS
• resin with properties in between 3Dresyn NMF-PDMS-like and 3Dresyn NMF-Glass-like
• UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
• Electron beam EB curable
• compatible and blendable with our 3Dreyns for nano & micro fabrication  
• Shore hardness D80
• biocompatible, ultra safe without any toxic pictograms
• high tensile and flexural strength >50 MPa
• tough, semi rigid   (Young modulus 1000-2000 MPa)
• elongation <20%
• imprint Temperature > 160ºC (short term)
• synthetic resin source
• durable
• high impact/shattering resistance
• low viscosity <1000 mPas 
• excellent balance of low viscosity for easy imprinting and low penetration  
• high refractive index 1.45-1.55
• very high resolution (printing resolution of less than 10 nm)
• low shrinkage <2%
• also printable by most commercial and professional SLA, DLP & LCD 3D printers
• organo-tin free
• high optical clarity
• high durability, non degradable
• excellent bonding, low risk of debonding
• high mechanical properties, with low risk of cracking
• very low degassing at high vacuum 
• low oxygen sensitivity
• high mechanical stability
• long shelf life of 1 year
• excellent spin coating application 
• excellent etching with Reactive Ion Etching
• excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
• low penetration
• low surface tension with good release and demolding properties
• 100% organic (free of inorganic materials) 
• contains hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
• no thermal treatment is required
• easy processing with standard lithography equipment
• easy removal of uncured resin with ketones, alcohols and esters

Applications

• easy & cost effective transparent tough stamp fabrication, alternative to quartz or electroplated stamps
• ideal for mass sensors based on UV-NIL, ALD and RIE