- sintering/curing T=120-140ºC (the higher the sintering temperature the lower the resistivity) for 5-10 minutes after 3D printing
- Conductivity: >2×10+6 S/m when used pure or in dip coatings
- Conductivity will decrease proportionally to its dilution in 3D resins down to 10−14 -10+2 S/m or higher*
Features of 3Dresyn NSEK1*:
- 3Dresyn NSEK1 (non water soluble) and 3Dresyn SEK1 (water soluble) can be blended to adjust water resistance and solubility to wish
- water solubility and swelling can be adjusted with our Soluble & Swellable Electrically Conductive 3Dresyn SEK1
- water resistance can be increased to wish with 1-15% 3Dresyn XL1
- Initial Conductivity of 3Dresyn NSEK1 of c. 10−3 S/m increases proportionally with additions of 3D ADD EK1
- Initial Conductivity of 3Dresyn NSEK1 of c. 10−3 S/m increases proportionally with additions of NaCl solutions above 1-2x10−1 S/m (0.3x10+4 Ω per square, 6-7 Ω.m)
- excellent dispersability and compatibility of 3D ADD EK1 and of most conductive nano and micronised conductive powders
- non water soluble nor swellable photoreactive printable 3d resin binder
- excellent water absorptivity for adjusting conductivity to wish
- water can be added before and/or after 3D printing
- soluble salts dissolved in water can be used for increasing conductivity
- excellent printability in any SLA, DLP and LCD printer
*Note: conductivity of 3D printed parts will depend on several variables, such as % 3D-ADD AGEK1, the specific 3D resin used, dosage of Fine Tuner FT1 and LB1 Bio and the sintering/curing cycle used. LCD 3D printers may exhibit printability limitations at high dosage of 3D-ADD AGEK1, due to their low light power . It is highly recommended to apply 3D-ADD AGEK1 to our 3Dresyn SEK1 and/or NSEK1 or by dipping 3D printed parts diluted to wish with our Conductive Thinner CT1