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3Dresyn NSEK1, non soluble EK 3D resin binder

Regular price 180.00 €

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3Dresyn NSEK1 is our Non Soluble EK 3D resin binder for 3D printing high conductivity materials for electronics e.g. antennas for IoT applications (HF, UHF), RFID and NFC tags, OLED, OPVs, flexible PCBs, flexible cables, etc...
It is non alcohol/water soluble nor swellable 3D resin binder, which is compatible with our conductive additive 3D-ADD AGEK1, which when used as supplied has these features:
  • sintering/curing T=120-140ºC (the higher the sintering temperature the lower the resistivity) for 5-10 minutes after 3D printing
  • Conductivity: >2×10+6  S/m when used pure or in dip coatings
  • Conductivity will decrease proportionally to its dilution in 3D resins down to 10−14 -10+2 S/m or higher*

    Features of 3Dresyn NSEK1*:

    • 3Dresyn NSEK1 (non water soluble) and 3Dresyn SEK1 (water soluble) can be blended to adjust water resistance and solubility as you wish
      • water solubility and swelling can be adjusted with our Soluble & Swellable Electrically Conductive 3Dresyn SEK1
      • water resistance can be custom increased with 1-15% 3Dresyn XL1
    • Initial Conductivity of 3Dresyn NSEK1 of c. 10−3  S/m increases proportionally with additions of 3D ADD EK1
    • Initial Conductivity of 3Dresyn NSEK1 of c. 10−3  S/m increases proportionally with additions of NaCl solutions above 1-2x10−1 S/m (0.3x10+4 Ω per square, 6-7 Ω.m)
    • excellent dispersability and compatibility of 3D ADD EK1 and of most conductive nano and micronised conductive powders
    • non water soluble nor swellable photoreactive printable 3d resin binder  
      • excellent water absorptivity for adjusting conductivity as you wish
        • water can be added before and/or after 3D printing 
        • soluble salts dissolved in water can be used for increasing conductivity
      • clear finishing
      • ultra hard and tough UHT, Shore Hardness D80-85
      • tack free finishes after light box postcuring
      • high tensile strength >40 MPa
      • high rigidity (Young modulus >2200 MPa)
      • non brittle, flexural strength >30 MPA
      • elongation <7%
      • very low viscosity, below 100 cps
      • excellent printability in any SLA, DLP and LCD printer

      *Note: conductivity of 3D printed parts will depend on several variables, such as % 3D-ADD AGEK1, the specific 3D resin used, dosage of Fine Tuner FT1 and LB1 Bio and the sintering/curing cycle used. LCD 3D printers may exhibit printability limitations at high dosage of 3D-ADD AGEK1, due to their low light power . It is highly recommended to apply 3D-ADD AGEK1 to our 3Dresyn SEK1  and/or NSEK1 or by dipping 3D printed parts diluted as you wish with our Conductive Thinner CT1