3Dresyn HIPS-like vs general-purpose rigid impact-resistant SLA / DLP / LCD 3D printing resins
Mechanical Resistance Comparison & Executive Summary
3Dresyn HIPS-like is a general-purpose engineering photopolymer designed to approximate a high-impact-polystyrene-like mechanical profile in additive manufacturing. It is positioned for applications requiring moderate rigidity, moderate impact tolerance and a practical balance between ease of use and engineering performance.
With flexural strength below 65 MPa, elongation below 30%, Young’s modulus around 2000 MPa and Shore D 60, HIPS-like occupies a middle zone between ABS-like and softer balanced engineering families.
Choose HIPS-like when the application requires practical rigid performance with some impact tolerance, but does not demand the harder structural positioning of PMMA-like or the more balanced technical focus of ABS-like.
Data Table — Typical Properties (post-cure; internal data and competitor TDS)
| Resin | Flexural strength | Elongation | Young’s modulus | Noted traits |
|---|---|---|---|---|
| 3Dresyn HIPS-like | <65 MPa | <30% | c. 2000 MPa | General-purpose rigid engineering response; Shore D 60; Tg >25 °C; moderate impact tolerance. |
| ABS-like engineering families | Varies | Varies | Medium | Often better balanced overall, but not always positioned for HIPS-like simpler rigid-impact use. |
| Formlabs Grey Pro | ~121 MPa / depends on strain definition | Low-to-moderate | ~2.2 GPa class | Closed ecosystem; more engineering-rigid than general-purpose HIPS-like positioning. |
| General-purpose rigid resin families | Varies | Varies | Varies | Broad category; many alternatives are either too brittle or too rigid for HIPS-like practical use. |
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Comparability note: HIPS-like positioning in photopolymers should be understood as a practical mechanical analogy rather than strict polymer equivalence. Comparisons require normalization of post-cure and mechanical test conditions.
Where 3Dresyn HIPS-like Wins
1) Practical rigid performance without moving to extreme structural grades
- HIPS-like is positioned for general rigid technical parts requiring moderate impact tolerance and useful shape retention.
2) Suitable for everyday engineering parts
- Useful for covers, housings, technical shells and general-purpose parts that do not need the strongest or hardest material in the portfolio.
3) More accessible engineering window
- Occupies a practical space between harder rigid materials and more balanced ABS-like families.
Application Guidance
- Choose 3Dresyn HIPS-like for: general-purpose rigid technical parts, covers, housings and moderate-impact engineering geometries.
- Choose ABS-like if a stronger stiffness–toughness balance is required.
- Choose PMMA-like if hardness and thermal resistance are more important.
Processing Notes (Quick Start)
- Compatible with open SLA, DLP and LCD systems in the 385–405 nm range.
- Use validated curing to maintain the intended rigid-impact balance.
Normalization & Caveats
- HIPS-like positioning is an engineering behaviour analogy, not direct equivalence to molded HIPS.
- Impact tolerance and stiffness depend on geometry and post-cure conditions.
References
- 3Dresyn HIPS-like internal product data
- Formlabs Grey Pro TDS
- Relevant general-purpose rigid resin documentation