Technical Bulletin - 3Dresyn Acetal POM-like 3D Resin
Rigid engineering photopolymer with acetal-like mechanical behaviour for functional additive manufacturing requiring dimensional stability, stiffness and precise part response.
Overview
3Dresyn® Acetal POM-like is a rigid engineering photopolymer designed to replicate a precise and structurally stable acetal-like mechanical profile in additive manufacturing. It is intended for parts requiring higher stiffness, dimensional stability and controlled deformation compared with softer tough or flexible engineering resins.
Its positioning is especially relevant for technical components, mechanism-related parts, rigid housings and structural geometries where repeatability and dimensional response matter more than high elongation or extreme impact softness.
Headline mechanical and thermal performance
| Property | Typical value | Reference |
|---|---|---|
| Flexural strength | <80–90 MPa | Internal product positioning |
| Tensile strength | <50 MPa | Internal product positioning |
| Young’s modulus | 2.5–3.0 GPa | Internal product positioning |
| Elongation at break | <25% | Internal product positioning |
| Shore hardness | D80–85 | Internal product positioning |
| Glass transition temperature (Tg) | >90 °C | Internal thermal characterization |
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This profile reflects a material intended for rigid technical behaviour, relatively low deformation and improved dimensional stability.
What makes 3Dresyn Acetal POM-like different
1) Higher modulus and more structural response
Acetal POM-like is positioned for applications where a more rigid and dimensionally stable response is required than can be achieved with low-modulus or highly ductile engineering resins.
2) Controlled deformation instead of extreme flexibility
The resin is engineered to resist excessive deformation while still avoiding the ultra-brittle behaviour typical of some very high-stiffness rigid composites.
3) Strong thermal and dimensional profile
With Tg above 90 °C and a Shore hardness in the D80–85 range, the material supports more dimensionally stable engineering use cases than softer functional families.
4) Open-system compatibility
Compatible with open 385–405 nm SLA, DLP and LCD systems, enabling broad process integration.
Application Guidance
- Rigid technical components
- Precision housings and covers
- Mechanism-related geometries
- Structural fixtures and dimensional inserts
- Engineering parts requiring stable shape retention
It is especially suitable where the application requires:
- Higher stiffness than PP-like, HDPE-like or Nylon-like families
- Better dimensional control than softer tough resins
- A more structural engineering response in functional parts
Processing Notes
- Printing technologies: SLA, DLP and LCD
- Wavelength range: 385–405 nm
- Compatible with open-parameter systems
- Optimized using structured calibration and validated post-curing workflows
Final performance depends on:
- Exposure conditions
- Layer thickness
- Build orientation
- Post-curing protocol
Normalization and engineering caveats
- POM-like should be understood as an engineering behaviour analogy, not direct equivalence to machined or molded acetal.
- Actual mechanical and dimensional performance depends on workflow control.
- Comparisons across suppliers require normalization of testing and post-processing conditions.
Conclusion
3Dresyn Acetal POM-like is positioned as a rigid and dimensionally stable engineering photopolymer for functional additive manufacturing where structural response, precise behaviour and repeatable geometry are more important than extreme ductility or maximum headline strength.
This technical bulletin should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.