Technical Bulletin - 3Dresyn HIPS-like 3D Resin
General-purpose rigid engineering photopolymer with HIPS-like mechanical behaviour for additive manufacturing requiring moderate stiffness, practical impact tolerance and useful shape retention.
Overview
3Dresyn® HIPS-like is a general-purpose rigid engineering photopolymer designed to provide a practical HIPS-like mechanical response in additive manufacturing. It is intended for parts requiring moderate stiffness, useful shape retention and some impact tolerance without moving to high-end rigid structural material classes.
Its role in the thermoplastic-like collection is to provide a practical general rigid engineering option for everyday technical parts.
Headline mechanical and thermal performance
| Property | Typical value | Reference |
|---|---|---|
| Flexural strength | <65 MPa | Internal product positioning |
| Tensile strength | <35 MPa | Internal product positioning |
| Young’s modulus | c. 2000 MPa | Internal product positioning |
| Elongation at break | <30% | Internal product positioning |
| Shore hardness | D60 | Internal product positioning |
| Glass transition temperature (Tg) | >25 °C | Internal thermal characterization |
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This profile reflects a practical rigid engineering material with moderate impact tolerance.
What makes 3Dresyn HIPS-like different
1) Practical general-purpose rigid behaviour
HIPS-like is positioned for technical parts that do not require the hardest, strongest or softest material in the range, but still need useful everyday engineering performance.
2) Moderate stiffness with some impact tolerance
The material sits between softer balanced families and harder rigid engineering classes.
3) Useful for general technical housings and shells
Suitable for rigid covers, technical shells and functional parts requiring practical shape retention and moderate survivability.
Application Guidance
- General-purpose rigid technical parts
- Covers and housings
- Technical shells
- Moderate-impact engineering geometries
Processing Notes
- Printing technologies: SLA, DLP and LCD
- Wavelength range: 385–405 nm
- Compatible with open-parameter systems
- Requires validated curing to preserve intended rigidity–impact balance
Normalization and engineering caveats
- HIPS-like positioning reflects engineering behaviour analogy, not direct equivalence to molded HIPS.
- Mechanical values depend on part geometry, cure workflow and post-processing.
Conclusion
3Dresyn HIPS-like is positioned as a general-purpose rigid engineering photopolymer for additive manufacturing applications requiring practical stiffness, moderate impact tolerance and useful shape retention in everyday technical parts.
This technical bulletin should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.