Technical Bulletin - 3Dresyn PC-like 3D Resin
Balanced engineering photopolymer with polycarbonate-like mechanical behaviour for additive manufacturing requiring useful stiffness, controlled deformation and durable functional response.
Overview
3Dresyn® PC-like is a balanced engineering photopolymer designed to provide a polycarbonate-like functional response in additive manufacturing. It is intended for parts requiring useful rigidity, controlled deformation and a durable engineering behaviour that sits between rigid structural grades and highly ductile materials.
This makes it particularly relevant for housings, structural covers and functional technical parts where a practical stiffness–toughness compromise is required.
Headline mechanical and thermal performance
| Property | Typical value | Reference |
|---|---|---|
| Flexural strength | <55 MPa | Internal product positioning |
| Tensile strength | <55 MPa | Internal product positioning |
| Young’s modulus | 1.0–1.4 GPa | Internal product positioning |
| Elongation at break | <40% | Internal product positioning |
| Shore hardness | D70 | Internal product positioning |
| Glass transition temperature (Tg) | >45 °C | Internal thermal characterization |
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This profile reflects a balanced functional engineering material rather than a highly rigid or highly ductile extreme.
What makes 3Dresyn PC-like different
1) Balanced engineering response
PC-like is positioned between rigid structural resins and highly deformable tough materials, offering a practical middle ground for functional additive manufacturing.
2) Useful shape retention with moderate deformation tolerance
The material provides more structural control than PP-like or highly ductile tough resins, while remaining more forgiving than rigid engineering grades.
3) Fit for general engineering and technical housings
Its mechanical window makes it suitable for durable housings, covers and functional components requiring moderate stiffness and useful survivability under real use.
Application Guidance
- Durable housings
- Structural covers
- Balanced engineering components
- Technical parts requiring a stiffness–toughness compromise
Processing Notes
- Printing technologies: SLA, DLP and LCD
- Wavelength range: 385–405 nm
- Compatible with open-parameter systems
- Optimized using structured calibration and validated post-cure workflows
Normalization and engineering caveats
- PC-like positioning reflects engineering behaviour analogy, not direct equivalence to molded polycarbonate.
- Mechanical values depend strongly on exposure, geometry and post-processing.
- Comparisons across suppliers require normalization of workflow conditions.
Conclusion
3Dresyn PC-like is positioned as a balanced engineering photopolymer for additive manufacturing applications requiring controlled deformation, useful rigidity and durable functional response without moving to the extremes of rigid or highly ductile material classes.
This technical bulletin should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.