

3Dresyn NMF Bio Soya1, bio based soya 3D resin for nano and micro fabrication
Product description
3Dresyn NMF Bio Soya1 is a UV & EB curable bio-based tough photopolymer for nano and micro fabrication, including printing of tough stamps for Nano Imprinting Lithography NIL, tough negative photoresists for standard UV lithography and PCB technology processing, and UV patterning of core and cladding.
This resin exhibits properties in between quartz glass and PDMS and is based on a renewable green source made from soybean and plants, with over 70% renewable bio-based content.
Application framework
Designed for nano and micro fabrication, UV lithography, PCB technology processing, Nano Imprinting Lithography NIL, spin coating, Reactive Ion Etching, wet and dry etching, and optical microfabrication workflows.
Typical applications
- Transparent bio-based tough stamp fabrication as an alternative to quartz or electroplated stamps
- Mass sensors based on UV-NIL, ALD and RIE
- Tough negative photoresists for standard UV lithography and PCB technology processing
- UV patterning of core and cladding
Measured mechanical properties
- Tensile strength: <40 MPa (ISO 527-1 / ISO 527-2)
- Flexural strength: <40 MPa (ISO 178)
- Young’s modulus: >1500 MPa (ISO 527)
- Elongation at break: <10% (ISO 527)
- Shore hardness: D60-70 (ISO 868)
Measured physical properties
- Imprint temperature: >160ºC (short term)
- Refractive index: 1.45-1.55
- Printing resolution: less than 10 nm
- Shrinkage: <6%
- Renewable bio-based content: >70%
- VOCs: 0%
- Water absorption: (ISO 20795-1)
- Viscosity: mPas at 23°C ± 2°C (ISO 3219)
Functional performance characteristics
- Resin with properties in between quartz glass and PDMS
- Bio based and renewable green source
- Eco-friendly, made from soybean and plants
- Odour free
- Ultra safe, toxic pictograms free
- UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
- Electron beam EB curable
- Compatible and blendable with our 3Dresyns for nano & micro fabrication
- Biocompatible, ultra safe without any toxic pictograms
- Tough, rigid
- Durable
- High impact/shattering resistance
- High optical clarity
- Excellent bonding, low risk of debonding
- High mechanical properties, with low risk of cracking
- Very low degassing at high vacuum
- Low oxygen sensitivity
- Low penetration
- Low surface tension with good release and demolding properties
- 100% organic (free of inorganic materials)
- Optionally it can contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
- Very high resolution
Processing and handling performance
- Excellent balance of low viscosity for easy imprinting and low penetration
- Long shelf life of 1 year
- Excellent spin coating application
- Excellent etching with Reactive Ion Etching
- Excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
- No thermal treatment is required
- Easy processing with standard lithography equipment
- Easy removal of uncured resin with ketones, alcohols and esters
Chemical and safety characteristics
- UV & EB curable bio-based photopolymer
- Bio based resin source
- Biocompatible
- Ultra safe without any toxic pictograms
- Organo-tin free
- 100% organic (free of inorganic materials)
- EN 71-3:2019 compliant
- BPA free
- Transition metals free
Testing & processing disclaimer
Final imprinting behavior, lithography behavior, etching performance, optical properties, substrate compatibility and processing performance must be validated by the user according to the intended application and processing conditions.
Disclaimer
This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.
This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.
Document reference: TDS-3DRESYN-NMF-BIO-SOYA1-EN | Version: 1.0 | Last updated: March 2026
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