3Dresyn TCR-Fluorosilicone1 has these features and benefits:
Temperature and Chemical Resistant Fluorosilicone
UV & EB curable silicone soft and elastic photopolymer for nano and micro fabrication (photolithography and softlithography), such as printing of soft and elastic stamps for Nano Imprinting lithography NIL and for soft & elastic negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
excellent chemical resistance to fuels and oils
UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
Electron beam EB curable
compatible and blendable with our 3Dreyns for nano & micro fabrication
100% foldable without breaking
synthetic resin source
Shore Hardness A20-40 range
medium tensile strength, <3 MPa
medium soft and elastic (Young modulus <7 MPa)
elongation at yield >100%
refractive index 1.35-1.4
durable
medium viscosity <6000 mPas
excellent balance of low viscosity for easy imprinting and low penetration
very high resolution (printing resolution of less than 10 nm)
very low shrinkage <0.1%
printable by most commercial and professional SLA, DLP & LCD 3D printers
organo-tin free
high optical clarity
high durability
excellent bonding, low risk of debonding
imprint Temperature 160ºC or higher
very low degassing at high vacuum
low oxygen sensitivity
high mechanical stability
long shelf life of 1 year
excellent spin coating application
excellent etching with Reactive Ion Etching
superior stability and chemical resistance to a wide range of wet chemistries used in the clean room
low penetration
low surface tension with good release and demolding properties
100% organic (free of inorganic materials)
contains Fluorine functionality
no thermal treatment is required
easy processing with standard lithography equipment
easy removal of uncured resin with ketones, alcohols and esters
Applications
UV curable molds for soft lithography
LED lighting encapsulation
power supplies
sensors
connectors
transformers
amplifiers
industrial controls
high voltage resistors
relays
adhesive/encapsulant for solar cells
photocurable adhesive for integrated circuits during processing
cost effective transparent stamp fabrication, alternative to quartz stamps
ideal for mass sensors based on UV-NIL, ALD and RIE
Note: this resin exhibits similar chemical resistance to conventional fluorosilicones. it is made to order and its delivery time is around 2-3 weeks after ordering.
