3D Adhesive HM1 "Hot Melt" has these features and benefits:
- low viscosity photocurable 3D adhesive
- curable with any UV/Visible light source from 200 to 420 nm
- after light curing becomes a non-sticky (non fragile) soft solid which becomes tacky & adhesive when heated providing strong bonding after cooling
- cures in 1-2 minutes under sunlight or in any standard light box at high thickness (from 0.1 to 1 cm)
- similar performance to traditional hot melt adhesives
- designed for adhering & gluing a broad range of plastics and metals when heated after cured
- ideal for printing directly on plastics or metals previously attached to the build platform, e.g. PCB base materials
- very low viscosity (<50 mPas) as supplied before curing
- very low shrinkage
- printable by commercial and professional SLA, DLP & LCD 3D printers with non sensitive resin tanks. Do not use it with Formlabs vats since 3D Adhesive HM1 can cause detachment of the PDMS from the bottom of the vat
- organo-tin free
