3Dresyn CDP-LDT WS, Low Debinding Temperature & Water Soluble 3D resin for printing, debinding and sintering ceramic, metal, polymer and exotic powders

Product description

3Dresyn® CDP-LDT WS is a low debinding temperature and water-soluble photopolymer binder system designed for additive manufacturing of ceramic, metal, polymer and exotic micron and submicron powder-loaded formulations.

The material enables efficient dispersion, high powder loading and accelerated debinding through combined water solubility and low-temperature thermal decomposition.

Application framework

Designed for use in vat photopolymerization systems (SLA and DLP) for the fabrication of powder-filled green bodies intended for debinding and sintering processes.

Typical applications

• Ceramic additive manufacturing (CIM)
• Metal additive manufacturing (MIM)
• Polymer and composite powder systems
• Micro- and nano-powder sintering applications
• Low-temperature debinding workflows

Measured / functional properties

• Debinding temperature: ~180–220°C
• Elongation: <10% (ISO 527-1 / ISO 527-2)
• Low viscosity with good flow behavior (internal method)
• High resolution: up to ~20 µm (process-dependent)
• Controlled shrinkage depending on powder loading (process-dependent)

Functional performance characteristics

• Low debinding temperature binder system (~180–220°C)
• Water-soluble for accelerated debinding
• Excellent dispersibility of micron and submicron powders
• Supports powder loading up to ~50 vol%
• Optimized for low sintering temperature materials with high surface area
• Partial oxidation capability for advanced debinding strategies
• Low expansion coefficient to minimize micro-fractures
• High resolution and detail reproduction

Processing and handling performance

• Printable by SLA and DLP 3D printers
• Water-cleanable prints
• Water-soluble binder system for simplified debinding workflows
• Compatible with wavelengths up to 410 nm (and higher upon request)
• Improved adhesion when used with 3Dresyn AP1 Adhesive Primer
• Increased durability of the resin tank
• Organo-tin free formulation

Testing & processing disclaimer

Material performance depends on powder type, particle size distribution, loading fraction, printer parameters and debinding/sintering profile. Final properties must be validated under the intended manufacturing conditions.

Why choose 3Dresyn® CDP-LDT WS

• Low-temperature debinding (~180–220°C)
• Fast debinding via water solubility
• High powder loading capability
• Good dispersion of micro and nano powders
• Optimized for low sintering temperature systems
• High resolution and controlled shrinkage

Regulatory & legal notice

This material is supplied as a professional manufacturing material and is not marketed as a finished product. Final part performance, debinding, sintering behavior and process validation remain the responsibility of the user.

Document reference: TDS-CDP-LDT-WS-EN | Version: 1.0 | Last updated: March 2026