3Dresyn NSEK1, Non Soluble EK 3D resin

Product description

3Dresyn® NSEK1 is a non-soluble photopolymer binder designed for the custom formulation of conductive 2D and 3D printed materials. It is specifically engineered for applications in printed electronics, including antennas, RFID/NFC devices, OLEDs, OPVs, flexible PCBs and conductive tracks.

This material functions as a versatile matrix compatible with conductive additives, dispersants and anti-sedimentation systems, enabling the development of tailored electrically functional resins. It provides controlled solubility and swelling behavior, allowing tuning of processing and end-use performance.

Application framework

Designed for use in SLA, DLP and LCD vat photopolymerization systems within research, development and industrial environments focused on printed electronics, functional materials and advanced additive manufacturing.

Typical applications

• Printed conductive tracks and circuits
• Antennas for IoT (HF, UHF), RFID and NFC tags
• Flexible printed electronics and interconnects
• OLED and OPV structures
• Flexible PCBs and cables
• Functional prototyping of conductive devices

Measured mechanical properties

• Tensile strength: <40 MPa (ISO 527)
• Flexural strength: <40 MPa (ISO 178)
• Young’s modulus: >2500 MPa (ISO 527)
• Elongation at break: <2% (ISO 527)
• Shore hardness: D80–85 (ISO 868)

Measured physical properties

• Viscosity: <100 mPa·s at 25 °C
• Appearance: clear
• Solubility: alcohol/water soluble and swellable (tunable)
• Printability: high resolution and stable processing

Functional performance characteristics

• Non-conductive base resin designed for conductive formulation development
• Compatible with a wide range of conductive additives (nano and micron scale)
• Compatible with dispersants and anti-sedimentation additives
• Adjustable solubility and water resistance through blending with 3Dresyn® SEK1
• Suitable for custom tuning of electrical, mechanical and processing properties
• High rigidity with elevated mechanical stiffness
• Clear finishing enabling optical inspection and process control

Processing and handling performance

• Compatible with SLA, DLP and LCD 3D printing systems
• Very low viscosity enabling efficient mixing and dispersion of conductive fillers
• Supports formulation of stable suspensions with appropriate dispersants
• Suitable for high-resolution printing of functional structures
• Designed for controlled processing in R&D and production environments

Chemical and safety characteristics

• Designed as a functional binder for conductive systems
• Organo-tin free formulation

Testing & processing disclaimer

Material performance depends on formulation with conductive additives, dispersion quality, printer type, exposure conditions and post-processing. Electrical, mechanical and chemical performance must be validated by the user for each specific application.

Disclaimer

This material is supplied as a professional formulation component for research, development and manufacturing workflows. It is not marketed as a finished electronic or medical device. Final part performance and suitability must be validated by the user.

Document reference: TDS-NSEK1-EN | Version: 1.0 | Last updated: March 2026