3Dresyn SEK1, Soluble & Swellable EK 3D resin

Product description

3Dresyn® SEK1 is a soluble and swellable photopolymer binder designed for the custom formulation of conductive 2D and 3D printed materials. It is specifically engineered for applications in printed electronics, including antennas, RFID/NFC devices, OLEDs, OPVs, flexible PCBs and conductive tracks.

This material functions as a versatile matrix compatible with conductive additives, dispersants and anti-sedimentation systems, enabling the development of tailored electrically functional resins. Its controlled water solubility and swelling behavior allows dynamic tuning of electrical, mechanical and processing performance.

Application framework

Designed for use in SLA, DLP and LCD vat photopolymerization systems within research, development and industrial environments focused on printed electronics, functional materials and advanced additive manufacturing.

Typical applications

• Printed conductive tracks and circuits
• Antennas for IoT (HF, UHF), RFID and NFC tags
• Flexible printed electronics and interconnects
• OLED and OPV structures
• Flexible PCBs and cables
• Water-soluble mandrels for electroforming and electroplating
• Functional prototyping of conductive devices

Measured mechanical properties

• Tensile strength: <40 MPa (ISO 527)
• Flexural strength: <40 MPa (ISO 178)
• Young’s modulus: >2000 MPa (ISO 527)
• Elongation at break: <3% (ISO 527)
• Shore hardness: D80 (ISO 868)

Measured physical properties

• Viscosity: <100 mPa·s at 25 °C
• Appearance: clear
• Solubility: water soluble or swellable (process-dependent)
• Printability: high resolution and stable processing

Functional performance characteristics

• Non-conductive base resin designed for conductive formulation development
• Compatible with a wide range of conductive additives (nano and micron scale)
• Compatible with dispersants and anti-sedimentation additives
• Water soluble or swellable depending on exposure energy and printer type
• Adjustable water resistance through blending with 3Dresyn® NSEK1
• High water absorptivity enabling conductivity tuning via aqueous systems
• Possibility to incorporate dissolved salts to modify electrical behavior
• Suitable for custom tuning of electrical, mechanical and processing properties
• Clear finishing enabling optical inspection and process control

Processing and handling performance

• Compatible with SLA, DLP and LCD 3D printing systems
• Very low viscosity enabling efficient mixing and dispersion of conductive fillers
• Supports formulation of stable suspensions with appropriate dispersants
• Water interaction can be applied before, during or after printing depending on application
• Suitable for high-resolution printing of functional structures
• Designed for controlled processing in R&D and production environments

Chemical and safety characteristics

• Designed as a functional binder for conductive systems
• Organo-tin free formulation

Testing & processing disclaimer

Material performance depends on formulation with conductive additives, dispersion quality, printer type, exposure conditions, water interaction and post-processing. Electrical, mechanical and chemical performance must be validated by the user for each specific application.

Disclaimer

This material is supplied as a professional formulation component for research, development and manufacturing workflows. It is not marketed as a finished electronic or medical device. Final part performance and suitability must be validated by the user.

Document reference: TDS-SEK1-EN | Version: 1.0 | Last updated: March 2026