NG 3Dresyn IJ R190D90 ultra rigid up to 190C

Product description

NG 3Dresyn IJ R190D90 ultra rigid up to 190C is an ultra rigid high-temperature photopolymer formulation designed for demanding inkjet 3D printing applications requiring very high stiffness, elevated mechanical strength and high thermal resistance. The material is engineered to deliver rigid structural performance together with very high dimensional stability and very high resolution.

This formulation provides a combination of very high modulus, very low elongation and very high Shore hardness, enabling the fabrication of rigid parts with excellent thermal resistance and controlled dimensional accuracy under demanding service conditions.

Application framework

Designed for use in commercial and professional inkjet 3D printing systems within industrial and engineering environments for manufacturing ultra-rigid, high-strength and high-temperature components.

Typical applications

• Ultra-rigid engineering components
• Functional prototypes requiring very high stiffness
• High-temperature structural and technical parts
• High-resolution rigid technical models

Measured mechanical properties

• Tensile strength: >40 MPa (ISO 527)
• Young’s modulus: 4000–5000 MPa (ISO 527)
• Elongation at break: <1% (ISO 527)
• Shore hardness: D90 (ISO 868)
• Heat deflection temperature: up to 190ºC at 0.45 MPa

Measured physical properties

• Inkjet viscosity: <20 mPas at 70ºC and <15 mPas at 80ºC
• Shrinkage: very low
• Resolution capability: very high
• Color stability: non-settling of color

Functional performance characteristics

• Ultra rigid material behavior
• Very high stiffness and structural integrity
• High thermal resistance
• Excellent dimensional stability
• Medium impact resistance with brittle fracture behavior
• Stable performance for demanding engineering applications

Processing and handling performance

• Printing technology: inkjet 3D printing
• Compatible with most commercial and professional inkjet 3D printers
• Stratasys: Objet Eden 260V, 260VS, 333, 350, 350V, 500, 500V, 1000 Plus, J750, Objet Connex 260, 350 and 500 series
• 3D Systems: ProJet MJP 2500, 2500+, 3500, 3510 and 3600 Plastic series
• Optimized viscosity for reliable jetting performance

Chemical and safety characteristics

• Synthetic resin source
• Biocompatible formulation
• Organo-tin free formulation

Testing & processing disclaimer

Material properties are measured under controlled laboratory conditions and may vary depending on printer model, jetting temperature, printing conditions, build geometry and post-processing workflow.

Disclaimer

This material is supplied as a professional manufacturing material for engineering and prototyping workflows. It is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

High heat deflection temperature resins, despite being rigid, tend to exhibit brittle behavior and limited long-term thermal stability at elevated temperatures. For applications requiring durable performance under sustained high-temperature conditions, conventional high-temperature polymers such as machined polyimide or injected PolyAmide Imide (PAI) may be more suitable depending on the application.

Document reference: TDS-IJ-R190D90-EN | Version: 1.1 | Last updated: March 2026