3Dresyn AgSEK1, soluble & swellable electrically conductive silver based 3D resin

Product description

3Dresyn AgSEK1 is a soluble or swellable electrically conductive silver based 3D resin for 3D printing high conductivity materials for electronics such as antennas for IoT applications (HF, UHF), RFID and NFC tags, OLED, OPVs, flexible PCBs and flexible cables.

It is an alcohol/water soluble or swellable 3D resin designed for conductive printing workflows requiring thin layers, tack free finishes after postcuring and electrically conductive performance.

Application framework

Designed for conductive vat photopolymerization workflows in SLA, DLP and LCD 3D printing for manufacturing electrically conductive materials and components for electronics applications.

Typical applications

• Antennas for IoT applications (HF, UHF)
• RFID and NFC tags
• OLED
• OPVs
• Flexible PCBs
• Flexible cables

Measured mechanical properties

• Tensile strength: <40 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <30 MPa (ISO 178)
• Young’s modulus: 2000-3000 MPa (ISO 527)
• Elongation at break: <3% (ISO 527)
• Shore hardness: D80-90 (ISO 868)

Measured physical properties

• Sheet resistance: >0.44 Ohm/square
• Resistivity: >8 micro Ohm.m
• Conductivity: <200 kS/m

Functional performance characteristics

• Water soluble or swellable photoreactive printable conductive 3D resin
• Tack free finishes after light box postcuring
• Electrically conductive silver based 3D resin

Processing and handling performance

• Printable at thin z layers of 10 microns in high power SLA, DLP printers
• 3Dresyn AgSEK1 is supplied in 3 parts
• Part 1 contains 65% by weight of the silver powder: 3D-ADD AgEK1 part 1
• Part 2 contains 35% by weight of the 3D resin: 3Dresyn SEK part 2
• Part 3 contains 2.5% of Fine Tuner FT1
• Mixing procedure: add part 1 slowly to part 2 under stirring with a Conn blade rotary mixer
• Avoid excessive energy to prevent excessive foaming and gelation
• Alternatively, a vortex mixer can also be used
• Once the mixture is properly dispersed add Part 3 and mix well
• The product once mixed has a short shelf life, especially if kept at >40-50ºC
• If stored in a fridge its shelf life can be extended longer
• It is recommended that the product is printed after its mixing to avoid any premature gelation
• After placing your order request more detailed Instructions for Use IFU for your specific SLA, DLP & LCD printer technology at info@3dresyns.com
• For more info read: Instructions for Use IFU for conductivity resin systems
• Low power printers may exhibit printability limitations at high Z layers
• In such cases reduce Z layer thickness and increase exposure times accordingly following the Instructions for Use IFU

Chemical and safety characteristics

• Alcohol/water soluble or swellable
• Silver based conductive system

Testing & processing disclaimer

Low power printers may exhibit printability limitations at high Z layers. In such cases reduce Z layer thickness and increase exposure times accordingly following the Instructions for Use IFU. Final conductivity, printability and processing stability depend on printer power, layer thickness, exposure conditions, mixing quality and storage conditions, and must be validated by the user.

Disclaimer

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Document reference: TDS-3DRESYN-AGSEK1-EN | Version: 1.0 | Last updated: March 2026