3Dresyn NMF PDMS-like A30 Biohas these features and benefits:
UV & EB curable organic soft and elastic photopolymer for nano and micro fabrication (photolithography and soft lithography), such as printing of soft and elastic stamps for Nano Imprinting lithography NIL and for soft & elastic negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
Shore Hardness A30 (relatively soft elastomer)
similar properties to silicone elastomers (PDMS) but increased tear and mechanical resistance
UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
Electron beam EB curable
compatible and blendable with our 3Dreyns for nano & micro fabrication
100% foldable without breaking
synthetic resin source
medium tensile and flexural strength, <3 MPa
medium rigidity (Young modulus < 5 MPa)
elongation at yield >100%
refractive index 1.45-1.55
durable
excellent balance of low viscosity for easy imprinting and low penetration
very high resolution (printing resolution of less than 10 nm)
very low shrinkage <1%
organo-tin free
high optical clarity
high durability, non degradable
excellent bonding, low risk of debonding
higher mechanical properties, with low risk of cracking
imprint Temperature up to 160ºC (short term)
very low degassing at high vacuum
low oxygen sensitivity
high mechanical stability
long shelf life of 1 year
excellent spin coating application
excellent etching with Reactive Ion Etching
excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
low-medium penetration
low surface tension with good release and demolding properties
100% organic (free of inorganic materials)
optionally it can contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
no thermal treatment is required
easy processing with standard lithography equipment
easy removal of uncured resin with ketones, alcohols and esters
Applications
UV curable molds for soft lithography
LED lighting encapsulation
power supplies
sensors
connectors
transformers
amplifiers
industrial controls
high voltage resistors
relays
adhesive/encapsulant for solar cells
photocurable adhesive for integrated circuits during processing
cost effective transparent stamp fabrication, alternative to quartz stamps
ideal for mass sensors based on UV-NIL, ALD and RIE
Note: this resin exhibits lower temperature resistance than conventional RTV silicones.
