3D-POWDER SLS UHMWPE25-55, fine & narrow particle size Ultra High Molecular Weight PolyEthylene UHMWPE powder for high resolution SLS printing

Product description

3D-POWDER SLS UHMPE25-55 is a specifically designed fine and narrow particle size Ultra High Molecular Weight PolyEthylene UHMWPE powder for SLS printing of high accuracy and resolution functional UHMWPE printed parts.

This translucent thermoplastic SLS spherical powder is designed for direct SLS printing of high quality functional UHMWPE parts with high low temperature toughness.

Application framework

Designed for selective laser sintering of functional UHMWPE powder parts requiring high accuracy, high resolution, low friction, wear resistance, chemical resistance and food or medical-related compliance.

Typical applications

• Pumping and valve parts
• Gaskets
• Glide profiles
• Food industry parts

Measured mechanical properties

• Tensile strength: <50 MPa (ISO 527-2)
• Flexural strength: 25-30 MPa (ISO 178)
• Young’s modulus: 700-900 MPa (ISO 527-2)
• Elongation at break: >50% (ISO 527-2)
• Shore hardness: D60-65 (ISO 868)
• Izod impact strength, notched: 40 J/m (ASTM D256 & ISO 180)

Measured physical properties

• Density: 0.93 g/cm³ (ISO 1183)
• Water absorption after 24 hours: <0.01% (ISO 62)
• Vicat softening temperature: 80ºC (ISO 306/B50)
• Melting temperature: 140-145ºC (ISO 11357)
• Coefficient of Friction COF-static: 0.28-0.29 (ISO 8295)
• Heat Deflection Temperature HDT at 0.45 MPa: 65-70ºC (ISO 75)
• Heat Deflection Temperature HDT at 1.8 MPa: 40-50ºC (ISO 75)
• Service temperature: from -50ºC up to 80-90ºC continuous
• High accuracy and resolution of final products: 50-100 microns depending on laser spot size and layer thickness

Functional performance characteristics

• Ideal SLS powder for direct SLS printing of high quality functional UHMWPE parts
• Low coefficient of friction
• Abrasion and wear resistance
• High impact strength
• Chemical and corrosion resistance
• Self-lubrication characteristics
• Zero moisture absorption
• Cryogenic capability
• Electrical resistivity
• Printable by most plastic / polymer powder SLS printers
• Excellent flow and levelling
• Compliant with FDA and USDA for use in food processing and medical applications

Processing and handling performance

• Typical narrow particle size distribution in microns, not to be considered a specification:
• D100: 100 (100% of particles have less than 100 microns)
• D90: 55 (90% of particles have less than 55 microns)
• D50: 35 (50% of particles have less than 35 microns)
• D10: 25 (10% of particles have less than 25 microns)
• D1: 15 (1% of particles have less than 15 microns)
• Recommended plastic or polymer powder SLS printers: SLS printer compatibility, any open mode plastic / polymer powder SLS printer can be used
• Recommended printing, debinding and sintering process: use the standard printing parameters of your equivalent polymer powder and follow 3Dresyns IFU for SLS printing
• Reference printing settings: energy density 2-40 J/cm2. Example: scan velocity of 1500-200 mm/s with 15-30 W CO2 laser (10.6 µm laser wavelength). Layer thickness <200 microns

Chemical and safety characteristics

• Ultra High Molecular Weight PolyEthylene UHMWPE powder
• Translucent thermoplastic powder
• FDA and USDA compliant for use in food processing and medical applications

Testing & processing disclaimer

The reported properties may vary depending of part design and manufacturing practices. It is the manufacturer’s responsibility to adjust the printing parameters and validate the suitability of the printed parts for the intended use. 3Dresyns makes no guarantee of properties, expressed or implied, regarding the accuracy of these results to be obtained from the use thereof.

Disclaimer

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Document reference: TDS-3D-POWDER-SLS-UHMWPE25-55-EN | Version: 1.0 | Last updated: March 2026