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    Instructions for Use (IFU) for UV and visible light curable putties, gels, fillers and sealants

    These Instructions for Use (IFU) define the workflow logic, handling boundaries and user responsibilities for UV- and visible-light curable putties, gels, fillers and sealants designed for moldable processing, controlled curing, repair, sealing, filling, shaping and temporary or durable assembly workflows.

    This document applies to 3Dresyns® 3Dputty material systems intended for hands-on shaping before cure and light-triggered fixation or consolidation after placement, including durable, sacrificial, hydrogel, water-removable, solvent-removable, breakable and high-temperature routes depending on the selected family.

    These workflows are process-dependent. Final performance depends on the complete material–application geometry–light source–cure depth–post-processing–service or removal chain, including putty family, placement thickness, substrate condition, curing wavelength and power, exposure time, accessibility of light to the full volume, and the final use or removal logic.

    1) Scope, limitations and responsibilities

    Scope of application

    • Applies to 3Dresyns® UV/visible-curable putties, gels, fillers and sealants.
    • Applies to workflows requiring moldable handling before cure and controlled light curing after placement.
    • Applies to durable, sacrificial, hydrogel, water-swellable, water-soluble, solvent-soluble, monomer-free, bio-based and high-HDT routes depending on the selected product family.

    Limitations

    • This document provides a qualified workflow framework and selection logic, but does not replace user-side validation.
    • Compatibility between the selected putty, substrate, light source, geometry and removal or service conditions must always be confirmed by the user.
    • Application-specific validation, regulatory compliance and final-use qualification remain the responsibility of the user or legal manufacturer.

    2) Governing principle

    In 3Dputty workflows, final performance is defined by the full process system, not only by the uncured handling feel.

    • selected 3Dputty route,
    • geometry and applied thickness,
    • substrate condition and adhesion environment,
    • light wavelength, power and exposure time,
    • cure depth and accessibility of the light path,
    • post-cure handling,
    • service conditions or sacrificial removal route,
    • thermal, water, solvent or mechanical removal logic where relevant.

    For this reason, the correct material should always be selected according to the final cured function and the intended removal or durability route.

    3) Product logic — durable, sacrificial and hydrogel routes

    The 3Dresyns® 3Dputty platform spans several workflow families:

    Durable routes

    Water-removable sacrificial routes

    Easy-breakable sacrificial routes

    Solvent-soluble sacrificial routes

    Hydrogel route

    The correct route should be selected primarily according to the intended final service or removal behavior.

    4) Substrate and application-surface preparation

    Application surfaces should be evaluated before use according to:

    • cleanliness,
    • surface dryness where relevant,
    • presence of dust, grease or release agents,
    • thermal sensitivity of the local area,
    • accessibility of curing light to the full applied volume,
    • required adhesion or easy-release behavior depending on the workflow.

    Contaminated or poorly prepared surfaces may reduce placement stability, impair cure performance or compromise final sealing, filling or sacrificial-removal logic.

    5) Material placement and shaping before cure

    These materials are designed for hands-on shaping before light curing.

    The user should control:

    • applied volume,
    • local thickness,
    • contact with the target surface,
    • void filling completeness,
    • edge shaping,
    • local geometry before cure.

    Thicker sections generally require more careful curing validation than thin surface applications. Deep or shadowed zones may require staged exposure, repositioning of the light source or thinner layer-by-layer build-up.

    6) Light curing conditions

    Final cure quality depends on the actual light source and the geometry of the application.

    The user should validate:

    • wavelength compatibility,
    • light intensity,
    • distance from light source to material,
    • exposure time,
    • cure depth,
    • surface and bulk cure completeness,
    • thermal sensitivity of the surrounding area during cure.

    Under-curing may lead to weak mechanical response, poor sealing, insufficient dimensional stability or premature failure during removal. Overexposure may alter surface quality, dimensional precision or local rigidity depending on the route.

    7) Durable routes — use logic

    Durable putties are relevant where the cured material is intended to remain in service after curing.

    • 3Dputty SE is relevant where a durable super-elastic final behavior is required.
    • 3Dputty HF Bio is relevant where a hard-flexible balance is preferred.
    • 3Dputty HDT is relevant where higher heat-deflection resistance is part of the target workflow.

    These routes should be selected for repair, sealing, shaping, assembly and maintenance tasks where the cured material is not intended to be removed.

    8) Water-removable sacrificial routes

    Water-removable sacrificial routes are relevant where temporary material placement is needed and the cured feature is later intended to be removed through water-assisted logic.

    • 3Dputty SF-WS is relevant where a water-swellable soft-flexible sacrificial route is required.
    • 3Dputty HDT-WS is relevant where a water-soluble sacrificial high-HDT route is required.

    Water-removal conditions should be validated according to:

    • part thickness,
    • water temperature,
    • immersion time,
    • agitation,
    • required structural hold before removal begins,
    • effect of swelling or dissolution on surrounding materials.

    9) Easy-breakable sacrificial routes

    Easy-breakable sacrificial routes are relevant where temporary structures must be removed primarily by manual breakage rather than by dissolution or swelling.

    • 3Dputty Crispy Bio is relevant where a crisp easy-breakable sacrificial route is needed.
    • 3Dputty SF Bio is relevant where a softer easy-breakable sacrificial route is preferred.

    Manual removal workflows should be validated according to geometry, thickness, accessibility and risk of damage to adjacent components.

    10) Solvent-soluble sacrificial routes

    Solvent-soluble sacrificial routes are relevant where controlled solvent-based removal is required after curing.

    Solvent-removal workflows should be validated according to:

    • solvent compatibility,
    • immersion or local exposure time,
    • temperature,
    • rate of removal,
    • effect on surrounding materials,
    • required dimensional retention before removal begins.

    11) Hydrogel route

    3Dputty SAE is relevant where swellable, absorbent and elastic hydrogel-like behavior is part of the intended workflow.

    This route should be selected where the final application depends on:

    • swelling response,
    • absorbency,
    • elastic hydrogel behavior,
    • durable service after light curing.

    Hydrogel-type applications should be validated according to the actual swelling medium, exposure time, dimensional change and mechanical response after conditioning.

    12) Validation and repeatability

    For repeatable 3Dputty implementation, users should validate the workflow in stages:

    • Stage 1: validate shaping and handling before cure
    • Stage 2: validate light curing and cure depth
    • Stage 3: validate the intended durable or sacrificial logic
    • Stage 4: validate service conditions or removal conditions
    • Stage 5: validate repeatability over repeated applications

    Repeatability should be confirmed using visual inspection, dimensional checks where relevant, functional screening and removal testing where applicable.

    13) Failure modes and quick interpretation

    Common failure modes in putty, gel, filler and sealant workflows may include:

    • Insufficient cure: weak internal structure, soft bulk or unstable final geometry
    • Poor adhesion or poor placement: contamination, poor substrate match or incomplete filling
    • Excessive rigidity or excessive softness: wrong route chosen for the final use case
    • Uncontrolled sacrificial removal: wrong water or solvent conditions, or removal logic not matched to geometry
    • Damage during breakaway removal: easy-breakable route not matched to surrounding structure
    • Unexpected swelling or insufficient swelling: hydrogel route not validated under the real conditioning medium

    Failure analysis should be based on the complete material–geometry–light–service/removal workflow, not only on the product name.

    14) Workflow selection by route

    The correct route depends mainly on the intended final behavior:

    15) Typical applications

    • sealing,
    • gap filling,
    • forming and shaping,
    • repairs and surface finishing,
    • temporary tooling, prototyping and assembly aids,
    • hydrogel-style specialty workflows where relevant.

    16) Product links

    17) Related documentation

    18) Governing principle

    These materials are designed for application-specific moldable light-curing workflows. Final performance depends on the complete material–placement–light curing–service or removal workflow and must be validated by the user for the intended application.

    19) Need technical support?

    For technical guidance, route selection, curing validation or custom development of UV/visible-curable putty, gel, filler or sealant workflows, contact info@3dresyns.com.

    From prototyping to industrial production, performance depends on materials, calibration and process control