3Dresyn HIPS-Like vs Engineering Resins

Mechanical Resistance Comparison & Executive Summary

3Dresyn HIPS-like is a general-purpose engineering photopolymer designed to approximate a high-impact-polystyrene-like mechanical profile in additive manufacturing. It is positioned for applications requiring moderate rigidity, moderate impact tolerance and a practical balance between ease of use and engineering performance.

With flexural strength below 65 MPa, elongation below 30%, Young’s modulus around 2000 MPa and Shore D 60, HIPS-like occupies a middle zone between ABS-like and softer balanced engineering families.

Choose HIPS-like when the application requires practical rigid performance with some impact tolerance, but does not demand the harder structural positioning of PMMA-like or the more balanced technical focus of ABS-like.

Data Table — Typical Properties (post-cure; internal data and competitor TDS)

Resin	Flexural strength	Elongation	Young’s modulus	Noted traits
3Dresyn HIPS-like	<65 MPa	<30%	c. 2000 MPa	General-purpose rigid engineering response; Shore D 60; Tg >25 °C; moderate impact tolerance.
ABS-like engineering families	Varies	Varies	Medium	Often better balanced overall, but not always positioned for HIPS-like simpler rigid-impact use.
Formlabs Grey Pro	~121 MPa / depends on strain definition	Low-to-moderate	~2.2 GPa class	Closed ecosystem; more engineering-rigid than general-purpose HIPS-like positioning.
General-purpose rigid resin families	Varies	Varies	Varies	Broad category; many alternatives are either too brittle or too rigid for HIPS-like practical use.

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Comparability note: HIPS-like positioning in photopolymers should be understood as a practical mechanical analogy rather than strict polymer equivalence. Comparisons require normalization of post-cure and mechanical test conditions.

Where 3Dresyn HIPS-like Wins

1) Practical rigid performance without moving to extreme structural grades

HIPS-like is positioned for general rigid technical parts requiring moderate impact tolerance and useful shape retention.

2) Suitable for everyday engineering parts

Useful for covers, housings, technical shells and general-purpose parts that do not need the strongest or hardest material in the portfolio.

3) More accessible engineering window

Occupies a practical space between harder rigid materials and more balanced ABS-like families.

Application Guidance

Choose 3Dresyn HIPS-like for: general-purpose rigid technical parts, covers, housings and moderate-impact engineering geometries.
Choose ABS-like if a stronger stiffness–toughness balance is required.
Choose PMMA-like if hardness and thermal resistance are more important.

Processing Notes (Quick Start)

Compatible with open SLA, DLP and LCD systems in the 385–405 nm range.
Use validated curing to maintain the intended rigid-impact balance.

Normalization & Caveats

HIPS-like positioning is an engineering behaviour analogy, not direct equivalence to molded HIPS.
Impact tolerance and stiffness depend on geometry and post-cure conditions.

References

3Dresyn HIPS-like internal product data
Formlabs Grey Pro TDS
Relevant general-purpose rigid resin documentation