3Dresyn BioDeg Corn F Flexible Biodegradable Compostable Corn Resin (85% Bio)

3Dresyn BioDeg Corn F is a bio-based, biodegradable and compostable semi-flexible thermoplastic photopolymer formulation developed for environmentally conscious SLA, DLP and LCD 3D printing workflows. The material incorporates approximately 85% total bio-based content derived from renewable sources, including corn-based and other plant-derived constituents functionalized for photopolymerization.

This material is designed to support sustainable additive manufacturing practices by enabling the fabrication of parts with reduced environmental persistence. It exhibits thermoplastic behavior, with increasing flexibility upon heating, and can undergo biological degradation into simpler substances under appropriate processing and environmental conditions.

Designed for use in vat photopolymerization systems (SLA, DLP and LCD) within professional and laboratory environments for prototyping, flexible components and applications where environmental impact and end-of-life considerations are relevant.

• Eco-conscious flexible prototypes and models
• Conceptual design parts requiring semi-flexible behavior
• Educational and research applications related to sustainable materials
• Applications requiring biodegradable or compostable material pathways

• Tensile strength: <5 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <5 MPa (ISO 178)
• Young’s modulus: <800 MPa (ISO 527)
• Elongation at break: <60% (ISO 527)
• Shore hardness: A50 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Printing shrinkage: no measurable dimensional shrinkage after calibration under validated processing conditions
• Resolution capability: high (process-dependent)
• Bio-based content: ~85% from renewable sources
• Viscosity: <7000 mPas at 23°C ± 2°C (ISO 3219)
• Printing difficulty: medium
• Flow behavior: excellent flow characteristics

• Semi-flexible material with thermoplastic behavior
• Increasing flexibility with temperature (10–50 °C range)
• More flexible than BioDeg Corn H grade
• Very low shrinkage supporting dimensional stability
• Designed for environmentally responsible material lifecycle

• Printing technologies: SLA, DLP and LCD
• Wavelength compatibility: 200–410 nm (with appropriate tuning)
• Curing behavior: slow to medium depending on formulation tuning
• Typical curing: 10–15 seconds at 50 µm (with FT1 tuning)
• Typical curing: 15–25 seconds at 50 µm (with FT5 Bio HP tuning)
• Compatible with most commercial and professional systems when properly calibrated
• Use of 3Dresyns Liquefier recommended for end-of-life processing

• Biodegradable and compostable under controlled conditions
• Biodegradation compliance: ISO 14855-2:2018 and ASTM D5338 reference frameworks
• OECD 301 F: >80% biodegradation after 60 days (after liquefaction process)
• Non-persistent and designed for reduced environmental impact

• BPA-free formulation
• Transition metal-free formulation
• Organo-tin free formulation
• EN 71-3:2019 compliant (reference framework)

Material properties are measured under controlled laboratory conditions and may vary depending on printer type, wavelength, formulation tuning, layer thickness, build orientation, post-processing and degradation conditions. Biodegradation performance depends on environmental conditions and validated processing protocols.

This material is supplied as a professional manufacturing material for prototyping and model fabrication workflows. It is not marketed as a finished medical device. The environmental performance and degradation behavior of final parts must be evaluated by the user under the intended conditions of use and disposal.

Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.

• Bio-Based 3D Printing Resins

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)