3Dresyn NMF Glass-like1 Bio, Biocompatible rigid photopolymer for nano and micro fabrication
3Dresyn NMF Glass-like1 Bio has these features and benefits:
- UV & EB curable organic ultra hard & rigid photopolymer for nano and micro fabrication (photolithography), such as printing of ultra hard & rigid stamps for Nano Imprinting lithography NIL and for hard & rigid negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
- resin with similar properties to quartz glass
- higher temperature resistance without deflection than PMMA
- harder and more rigid than PMMA at room and at high temperature
- UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
- very fast photo curing, ideal for low power light sources
- Electron beam EB curable
- compatible and blendable with our 3Dreyns for nano & micro fabrication
- extra hard Shore D90
- biocompatible, ultra safe without any toxic pictograms
- high tensile and flexural strength >40 MPa
- high transmittance @ 850 nm
- rigid (Young modulus >3000 MPa)
- elongation <1%
- high temperature resistance up to 290 ºC (short term) without deformation
- High deflection temperature >290ºC
- imprint Temperature > 160ºC (short term)
- synthetic resin source
- durable
- medium impact/shattering resistance
- excellent balance of low viscosity for easy imprinting and low penetration
- refractive index 1.48-1.52
- very high resolution (printing resolution of less than 10 nm)
- low shrinkage <9%
- organo-tin free
- high optical clarity
- high durability, non degradable
- excellent bonding, low risk of debonding
- high mechanical properties, with low risk of cracking
- very low degassing at high vacuum
- low oxygen sensitivity
- high mechanical stability
- high chemical resistance
- long shelf life of 1 year
- excellent for spin coating applications
- excellent etching with Reactive Ion Etching
- excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
- low penetration
- low surface tension with good release and demolding properties
- 100% organic (free of inorganic materials)
- optionally it can contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
- no thermal treatment is required
- easy processing with standard lithography equipment
- easy removal of uncured resin with ketones, alcohols and esters
Chemical resistance:
|
Solvent |
Solvent resistance* |
|
Acetic acid (5%) |
<0.1% |
|
Acetone |
<2% |
|
Bleach (5% NaOCl) |
<0.1% |
|
Butyl acetate |
<0.1% |
|
Diesel fuel |
<0.1% |
|
Diethyl glycol monomethyl ether |
<0.1% |
|
Hydraulic oil |
<0.1% |
|
Hydrogen peroxide (3%) |
<0.1% |
|
Isooctane (aka gasoline) |
<0.1% |
|
Isopropyl alcohol |
<0.1% |
|
Mineral oil (light) |
<0.1% |
|
Mineral oil (heavy) |
<0.1% |
|
Salt water (3.5% NaCl) |
<0.1% |
|
Sodium hydroxide (0.0001M NaOH: pH=10) |
<0.1% |
|
Strong acid (1M HCl hydrochloric acid: pH=0) |
<0.1% |
|
Tripropylene glycol monomethyl ether |
<0.1% |
|
Water |
<0.01% |
|
Xylene |
<0.1% |
*weight increase (%) after 24 hour exposure to solvent
Applications
- easy & cost effective transparent mould and stamp fabrication, alternative to quartz or electroplated stamps
- mass sensors based on UV-NIL, ALD and RIE
- UV patterning of core and cladding
- mechanical resonators with reduced dampening of piezoelectric actuators
- optical Single Mode SM and Multi Mode MM waveguides
- beam splitters
- biosensors
- Fast and contactless prototyping by direct laser writing at 405 nm (200-410 nm)
- etch mask for wet and dry etching
- mould for electroplating
- optical applications
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