3Dresyn NMF HAR1 Bio has these features and benefits:
UV & EB curable organic high aspect ratio & ultra rigid photopolymer for nano and micro fabrication, such as printing of ultra rigid stamps for Nano Imprinting lithography NIL and negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
resin with properties similar to quartz glass
UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
Electron beam EB curable
compatible and blendable with our 3Dreyns for nano & micro fabrication
Shore hardness D90
biocompatible, ultra safe without any toxic pictograms
medium tensile and flexural strength <40 MPa
ultra rigid (Young modulus 4000-6000 MPa)
elongation <1%
high temperature resistance up to 290 ºC (short term) without deformation
High deflection temperature >290ºC
imprint Temperature > 160ºC
synthetic resin source
durable
high impact/shattering resistance
excellent balance of low viscosity for easy imprinting and low penetration
high refractive index 1.45-1.55
very high resolution (printing resolution of less than 10 nm)
medium shrinkage <13%
organo-tin free
high optical clarity
high durability, non degradable
excellent bonding, low risk of debonding
medium-high mechanical properties, with low risk of cracking
very low degassing at high vacuum
ultra low oxygen sensitivity despite its ultra low viscosity
high mechanical stability
long shelf life of 1 year
excellent spin coating application
excellent etching with Reactive Ion Etching
excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
ultra low penetration
low surface tension with good release and demolding properties
100% organic (free of inorganic materials)
optionally it can contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
no thermal treatment is required
easy processing with standard lithography equipment
easy removal of uncured resin with ketones, alcohols and esters
Applications
easy & cost effective transparent ultra rigid stamp fabrication, alternative to quartz or electroplated stamps
ideal for mass sensors based on UV-NIL, ALD and RIE
