3Dresyn NMF HAR1 Bio, Biocompatible High Aspect Ratio ultra rigid photopolymer for nano and micro fabrication

3Dresyn NMF HAR1 Bio has these features and benefits:

• UV & EB curable organic high aspect ratio & ultra rigid photopolymer for nano and micro fabrication, such as printing of ultra rigid stamps for Nano Imprinting lithography NIL and negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
• resin with properties similar to quartz glass
• UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
• Electron beam EB curable
• compatible and blendable with our 3Dreyns for nano & micro fabrication  
• Shore hardness D90
• biocompatible, ultra safe without any toxic pictograms
• medium tensile and flexural strength <40 MPa
• ultra rigid (Young modulus 4000-6000 MPa)
• elongation <1%
• high temperature resistance up to 290 ºC (short term) without deformation
• High deflection temperature >290ºC
• imprint Temperature > 160ºC
• synthetic resin source
• durable
• high impact/shattering resistance
• excellent balance of low viscosity for easy imprinting and low penetration  
• high refractive index 1.45-1.55
• very high resolution (printing resolution of less than 10 nm)
• medium shrinkage <13%
• organo-tin free
• high optical clarity
• high durability, non degradable
• excellent bonding, low risk of debonding
• medium-high mechanical properties, with low risk of cracking
• very low degassing at high vacuum 
• ultra low oxygen sensitivity despite its ultra low viscosity
• high mechanical stability
• long shelf life of 1 year
• excellent spin coating application 
• excellent etching with Reactive Ion Etching
• excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
• ultra low penetration
• low surface tension with good release and demolding properties
• 100% organic (free of inorganic materials) 
• contains hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
• no thermal treatment is required
• easy processing with standard lithography equipment
• easy removal of uncured resin with ketones, alcohols and esters

Applications

• easy & cost effective transparent ultra rigid stamp fabrication, alternative to quartz or electroplated stamps
• ideal for mass sensors based on UV-NIL, ALD and RIE