3Dresyn NMF HF1 Bio, Biocompatible Hard & Flexible photopolymer for nano and micro fabrication

Product description

3Dresyn NMF HF1 Bio is a UV & EB curable organic hard & flexible photopolymer for nano and micro fabrication, including printing of hard & flexible stamps for Nano Imprinting lithography NIL and hard & flexible negative photoresists for standard UV lithography & PCB technology processing, and UV patterning of core and cladding.

This resin exhibits properties in between quartz glass and PDMS and provides a combination of hardness, flexibility, high optical clarity and very high resolution for nano and micro fabrication workflows.

Application framework

Designed for nano and micro fabrication, UV lithography, PCB technology processing, Nano Imprinting Lithography NIL, spin coating, Reactive Ion Etching, wet and dry etching, and optical microfabrication workflows.

Typical applications

• Transparent tough stamp fabrication as an alternative to quartz or electroplated stamps
• Mass sensors based on UV-NIL, ALD and RIE
• Hard & flexible negative photoresists for standard UV lithography and PCB technology processing
• UV patterning of core and cladding

Measured mechanical properties

• Tensile strength: <30 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <30 MPa (ISO 178)
• Young’s modulus: >1000 MPa (ISO 527)
• Elongation at break: <50% (ISO 527)
• Shore hardness: D70 (ISO 868)

Measured physical properties

• Imprint temperature: >160ºC (short term)
• Refractive index: 1.45-1.55
• Printing resolution: less than 10 nm
• Shrinkage: <3%
• Water absorption: (ISO 20795-1)
• Viscosity: mPas at 23°C ± 2°C (ISO 3219)

Functional performance characteristics

• Resin with properties in between quartz glass and PDMS
• UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
• Electron beam EB curable
• Compatible and blendable with our 3Dresyns for nano & micro fabrication
• Biocompatible, ultra safe without any toxic pictograms
• Hard and flexible
• Durable
• Very high impact/shattering resistance
• High optical clarity
• High durability, non degradable
• Excellent bonding, low risk of debonding
• High mechanical properties, with low risk of cracking
• Very low degassing at high vacuum after curing
• Low oxygen sensitivity
• High mechanical stability
• Low penetration
• Low surface tension with good release and demolding properties
• 100% organic (free of inorganic materials)
• Optionally it can contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)

Processing and handling performance

• Excellent balance of low viscosity for easy imprinting and low penetration
• Long shelf life of 1 year
• Excellent spin coating application
• Excellent etching with Reactive Ion Etching
• Excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
• No thermal treatment is required
• Easy processing with standard lithography equipment
• Easy removal of uncured resin with ketones, alcohols and esters

Chemical and safety characteristics

• UV & EB curable organic photopolymer
• Biocompatible
• Ultra safe without any toxic pictograms
• Synthetic resin source
• Organo-tin free
• 100% organic (free of inorganic materials)
• Excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room

Testing & processing disclaimer

Final imprinting behavior, lithography behavior, etching performance, optical properties, substrate compatibility and processing performance must be validated by the user according to the intended application and processing conditions.

Disclaimer

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Document reference: TDS-3DRESYN-NMF-HF1-BIO-EN | Version: 1.0 | Last updated: March 2026