3Dresyn NMF PDMS-like A30 Bio, Biocompatible very soft silicone like photopolymer with Shore A30 for nano and micro fabrication

3Dresyn NMF PDMS-like A30 Bio has these features and benefits:

• UV & EB curable organic soft and elastic photopolymer for nano and micro fabrication (photolithography and soft lithography), such as printing of soft and elastic stamps for Nano Imprinting lithography NIL and for soft & elastic negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
• Shore Hardness A30 (relatively soft elastomer)  
• similar properties to silicone elastomers (PDMS) but increased tear and mechanical resistance 
• UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
• Electron beam EB curable
• compatible and blendable with our 3Dreyns for nano & micro fabrication  
• 100% foldable without breaking
• synthetic resin source
• medium tensile and flexural strength, <3 MPa
• medium rigidity (Young modulus < 5 MPa)
• elongation at yield >100%
• refractive index 1.45-1.55
• durable
• excellent balance of low viscosity for easy imprinting and low penetration  
• very high resolution (printing resolution of less than 10 nm)
• very low shrinkage <1%
• organo-tin free
• high optical clarity
• high durability, non degradable
• excellent bonding, low risk of debonding
• higher mechanical properties, with low risk of cracking
• imprint Temperature up to 160ºC (short term)
• very low degassing at high vacuum 
• low oxygen sensitivity
• high mechanical stability
• long shelf life of 1 year
• excellent spin coating application 
• excellent etching with Reactive Ion Etching
• excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
• low-medium penetration
• low surface tension with good release and demolding properties
• 100% organic (free of inorganic materials) 
• optionally it can contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
• no thermal treatment is required
• easy processing with standard lithography equipment
• easy removal of uncured resin with ketones, alcohols and esters

Applications

• UV curable molds for soft lithography
• LED lighting encapsulation
• power supplies
• sensors
• connectors
• transformers
• amplifiers
• industrial controls
• high voltage resistors
• relays
• adhesive/encapsulant for solar cells
• photocurable adhesive for integrated circuits during processing
• cost effective transparent stamp fabrication, alternative to quartz stamps
• ideal for mass sensors based on UV-NIL, ALD and RIE

Note: this resin exhibits lower temperature resistance than conventional RTV silicones.