3Dresyn NSEK1 Photopolymer Binder Resin

3Dresyn® NSEK1 is a non-soluble photopolymer binder designed for the custom formulation of conductive 2D and 3D printed materials. It is specifically engineered for applications in printed electronics, including antennas, RFID/NFC devices, OLEDs, OPVs, flexible PCBs and conductive tracks.

This material functions as a versatile matrix compatible with conductive additives, dispersants and anti-sedimentation systems, enabling the development of tailored electrically functional resins. It provides controlled solubility and swelling behavior, allowing tuning of processing and end-use performance.

Designed for use in SLA, DLP and LCD vat photopolymerization systems within research, development and industrial environments focused on printed electronics, functional materials and advanced additive manufacturing.

• Printed conductive tracks and circuits
• Antennas for IoT (HF, UHF), RFID and NFC tags
• Flexible printed electronics and interconnects
• OLED and OPV structures
• Flexible PCBs and cables
• Functional prototyping of conductive devices

• Tensile strength: <40 MPa (ISO 527)
• Flexural strength: <40 MPa (ISO 178)
• Young’s modulus: >2500 MPa (ISO 527)
• Elongation at break: <2% (ISO 527)
• Shore hardness: D80–85 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Appearance: clear
• Viscosity: <100 mPas at 23°C ± 2°C (ISO 3219)
• Very low viscosity enabling efficient mixing and dispersion of conductive fillers
• Solubility: alcohol/water soluble and swellable (tunable)
• Printability: high resolution and stable processing

• Non-conductive base resin designed for conductive formulation development
• Compatible with a wide range of conductive additives (nano and micron scale)
• Compatible with dispersants and anti-sedimentation additives
• Adjustable solubility and water resistance through blending with 3Dresyn® SEK1
• Suitable for custom tuning of electrical, mechanical and processing properties
• High rigidity with elevated mechanical stiffness
• Clear finishing enabling optical inspection and process control

• Compatible with SLA, DLP and LCD 3D printing systems
• Supports formulation of stable suspensions with appropriate dispersants
• Suitable for high-resolution printing of functional structures
• Designed for controlled processing in R&D and production environments

• Designed as a functional binder for conductive systems
• Organo-tin free formulation

Material performance depends on formulation with conductive additives, dispersion quality, printer type, exposure conditions and post-processing. Electrical, mechanical and chemical performance must be validated by the user for each specific application.

This material is supplied as a professional formulation component for research, development and manufacturing workflows. It is not marketed as a finished electronic or medical device. Final part performance and suitability must be validated by the user.

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)