NextGen 3Dresyn R140D90 Ultra Rigid Heat-Resistant Resin (140C, D90)

Product description

NG 3Dresyn R140D90 is an extra hard, heat-resistant photopolymer formulation designed for advanced engineering applications in SLA, DLP and LCD 3D printing workflows. The material provides very high stiffness, dimensional stability and controlled thermal resistance up to 140 °C, enabling the production of rigid components operating under demanding conditions.

This formulation is based on a synthetic resin system optimized for high mechanical strength, dimensional precision and reliable processing.

Application framework

Designed for use in vat photopolymerization systems (SLA, DLP and LCD) within professional and industrial environments for rigid, structural and heat-resistant components.

Typical applications

• Rigid structural and technical components
• Tooling, jigs and fixtures
• High-stiffness positioning fixtures
• Engineering prototypes requiring stiffness and thermal resistance

Measured mechanical properties

• Tensile strength: >50 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: >40 MPa (ISO 178)
• Young’s modulus: 2700–3100 MPa (ISO 527)
• Elongation at break: <2.5% (ISO 527)
• Shore hardness: D90 (ISO 868)

Measured physical properties

• Thermal resistance: stable up to 140 °C (typical, workflow dependent)
• Shrinkage: very low (typical)
• Resolution capability: high (process-dependent)

Functional performance characteristics

• Ultra rigid material behavior with very high stiffness
• Controlled thermal resistance up to 140 °C
• High dimensional precision and stability
• Low deformation under load

Processing and handling performance

• Printing technologies: SLA, DLP and LCD
• Compatible with most commercial and professional systems when properly calibrated
• Proper washing and post-curing are required to achieve final mechanical and thermal properties
• Recommended printing temperature: 20–25 °C

Chemical and safety characteristics

• Organo-tin free formulation
• BPA-free formulation
• Transition metal-free formulation

Testing & processing disclaimer

Material properties are measured under controlled laboratory conditions and may vary depending on printer type, exposure conditions, layer thickness, build orientation, post-curing conditions and post-processing workflow.

Disclaimer

This material is supplied as a professional manufacturing material for engineering and prototyping workflows. It is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Document reference: TDS-NG-R140D90-EN | Version: 1.0 | Last updated: June 2026