NextGen 3Dresyn R290D90 Ultra Rigid High-Temperature Resin (290C, D90)

NG 3Dresyn R290D90 is an extra hard, high-temperature resistant photopolymer formulation designed for advanced engineering applications in SLA, DLP and LCD 3D printing workflows. The material delivers very high stiffness, dimensional stability and extreme thermal resistance, enabling the fabrication of parts operating under demanding thermal conditions.

This formulation is based on a synthetic resin system engineered to achieve high heat deflection performance while maintaining excellent printability and surface resolution.

Designed for use in vat photopolymerization systems (SLA, DLP and LCD) within professional and industrial environments for high-temperature and structurally demanding components.

• High-temperature tooling and mold inserts
• Heat-resistant fixtures and jigs
• Structural components exposed to elevated temperatures
• Engineering prototypes requiring high stiffness and thermal resistance

• Tensile strength: >40 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: >40 MPa (ISO 178)
• Young’s modulus: 4000–5000 MPa (ISO 527)
• Elongation at break: <1% (ISO 527)
• Shore hardness: D90 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Printing shrinkage: no measurable dimensional shrinkage after calibration under validated processing conditions
• Resolution capability: very high (process-dependent)
• Color stability: non-settling formulation
• Viscosity: <1000 mPas at 23°C ± 2°C (ISO 3219)
• Very low viscosity enabling fast recoating and stable processing

• Heat Deflection Temperature (HDT): up to 290°C @ 0.45 MPa (ISO 75)

• Extra hard and ultra rigid material behavior
• High thermal resistance up to elevated temperatures
• High dimensional stability
• Durable under static load conditions
• Medium impact and shattering resistance

High Heat Deflection Temperature (HDT) photopolymer resins, despite their rigidity, may exhibit brittle behavior and reduced lifetime under prolonged thermal exposure. For applications requiring long-term durability at high temperatures, alternative materials such as machined polyimide, or injection-molded PolyAmide Imide (PAI) or similar high-performance polymers, should be considered.

• Printing technologies: SLA, DLP and LCD
• Compatible with most commercial and professional systems when properly calibrated
• Increased durability of the resin tank during printing

• Biocompatible (final part validation required)
• Synthetic resin base
• Organo-tin free formulation

Material properties are measured under controlled laboratory conditions and may vary depending on printer type, exposure conditions, layer thickness, build orientation and post-processing workflow.

This material is supplied as a professional manufacturing material for engineering and prototyping workflows. It is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.

• Engineering & Functional 3D Resins
• Next-Generation Functional 3D Printing Resins

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)