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Heat soluble "meltable" 3D resins

3Dresyns Castable & Heat-Soluble Resins — choose the Perfect Cast HS or LMM family 3DRESYNS · CASTABLE & HEAT-SOLUBLE RESINS CASTABLE & HEAT-MELTABLE RESINS Choose by family — heat-soluble castable or jewelry LMM WHICH CASTABLE FAMILY DO YOU NEED? PERFECT CAST HS HS1 · HS2 Heat-soluble & meltable castable: solid + liquid. LMM PERFECT CAST PC1 · PC2 Heat-meltable solid castings for jewelry (LMM). ⚠ Remember: castable & heat-removable resins — not the finished casting. Validate melt-out/burnout, geometry & casting cycle for your process. At-a-glance summary · full comparison table & product details on the page.

Thermal-removal and castable resin systems designed for heat-soluble, meltable and flowable behavior depending on grade, enabling simplified post-processing, indirect manufacturing and castable workflows for complex geometries, enclosed cavities and jewelry-oriented applications.

Heat-removable sacrificial and castable materials platform

This collection groups the 3Dresyns® heat-soluble, meltable and castable materials for indirect manufacturing and thermal-removal workflows, focused here on Perfect Cast HS and LMM Perfect Cast families for castable and heat-meltable applications.

Key features & benefits

  • thermal removal concepts for sacrificial and castable workflows
  • meltable or heat-soluble behavior depending on grade
  • simplified post-processing
  • reduced reliance on solvent-based removal routes
  • support for indirect manufacturing of complex cavities and castable structures

Typical applications

  • thermal-removal sacrificial structures
  • complex internal channels and enclosed cavities
  • indirect manufacturing routes
  • castable concepts for difficult-to-clean geometries
  • jewelry-oriented heat-meltable workflows

Why choose this collection

Focused thermal-removal logic

This reduced version of the collection is centered on materials whose workflow value comes mainly from heat-soluble, meltable or castable thermal-removal behavior, making the positioning cleaner and more coherent.

Useful for enclosed and hard-to-access geometries

These materials are especially relevant where thermal removal, melting or castable elimination is operationally easier than conventional support cleaning or dissolution-based routes.

Clear split between HS and PC families

The collection now reads more clearly as two main families: Perfect Cast HS for heat-soluble / meltable castable routes, and LMM Perfect Cast for jewelry-oriented heat-meltable castable workflows.

Products in this collection

Technical overview

Material family* Properties Removal / burnout logic Material format Target workflow Technology fit Special function
Perfect Cast HS1 Bio Heat soluble, meltable, flowable and castable bio-based solid wax Thermal melt / heat-soluble removal Solid wax-like format Castable and thermal-removal support concepts SLA / DLP / LCD workflows Solid wax-like castable route
Perfect Cast HS2 MF Bio Heat soluble, meltable, flowable and castable bio-based liquid 3D resin Thermal melt / heat-soluble removal Liquid resin format Castable and thermal-removal support concepts SLA / DLP / LCD workflows Liquid heat-soluble castable route
LMM Perfect Cast PC1 Castable solid photopolymer for heat meltable castings Heat meltable casting logic Solid castable format Jewelry-oriented LMM workflows LMM Heat meltable jewelry castings
LMM Perfect Cast PC2 Castable solid photopolymer for heat meltable castings Heat meltable casting logic Solid castable format Jewelry-oriented LMM workflows LMM Alternative heat meltable jewelry route

Mobile: scroll horizontally to view all columns. The first column remains visible while scrolling.

Portfolio overview

Perfect Cast HS family

HS1 Bio and HS2 MF Bio define the heat-soluble and meltable castable side of the collection, with one solid wax-like format and one liquid resin format.

LMM Perfect Cast family

PC1 and PC2 define the jewelry-oriented heat-meltable solid castable routes for LMM workflows.

Clean collection logic

This reduced version keeps the page tightly focused on heat-soluble, meltable and heat-meltable castable materials, which makes selection much clearer for users comparing thermal-removal workflows.

Workflow note

The right route depends mainly on whether you need a heat-soluble / meltable castable resin or a heat-meltable solid casting route.

Choose HS1 or HS2 when the workflow benefits from heat-soluble or meltable castable behavior in SLA/DLP/LCD workflows. Choose PC1 or PC2 when the priority is jewelry-oriented heat-meltable castings within LMM-related workflows.

Technical and commercial support

Need help selecting the right heat-soluble or meltable castable resin?

This revised collection is designed to help users compare only HS and PC families for thermal-removal, castable and jewelry-oriented heat-meltable workflows.

For technical guidance or custom developments, use technical support.

Related casting routes

Thermal-removal workflows

Compare meltable resin routes with adjacent casting processes

Heat-soluble and meltable resin selection should be matched to the complete casting route, including whether the workflow uses conventional castable photopolymers or Lithography-based Metal Manufacturing.