3D-ADD CuVK2 – Copper Antimicrobial Additive is a cost-effective copper-based liquid paste designed for incorporation into compatible 3Dresyn photopolymer systems prior to printing.
It is designed for functional parts where copper incorporation and surface interaction properties are desired.
Designed for use in compatible SLA, DLP, LCD and Inkjet 3Dresyn systems prior to printing.
The performance of copper-containing printed parts depends on copper concentration, dispersion quality, processing parameters and final part geometry. Any antimicrobial performance claims of finished products must be validated and assessed in accordance with applicable regulations by the legal manufacturer.
This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.
This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.
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