3D-ADD Self-Heal Rigid — Optic · Thermal-Weld · BioGen

Self-healing booster engineered for rigid and tough photopolymers for SLA, DLP and LCD printing at 385–405 nm.

It builds a reversible bonding network that enables local micro-welding of cracks and stronger interlayer fusion after a short activation, while preserving high stiffness and dimensional stability in service. Three tuned versions are described: Optic, Thermal-Weld and BioGen.

Designed for use with rigid and tough engineering photopolymers operating at 385–405 nm in SLA, DLP and LCD systems. Suitable for clear and pigmented systems requiring improved interlayer welding, crack arrest and self-healing behavior.

• Functional housings and covers
• Jigs, fixtures and tooling
• Snap-fits and brackets prone to stress whitening or brittle failure
• Precision rigid parts requiring reliable layer adhesion

• Density (25 °C): ~1.10–1.20 g·cm⁻³ (ISO 1675)
• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Appearance: pale yellow to light amber, clear
• VOC: 0%
• Viscosity (25 °C): ~400–800 mPa·s
• Viscosity: ~400–800 mPas at 23°C ± 2°C (ISO 3219)
• Odor: very low
• Recommended use level: 5–15 wt% in rigid/tough resins
• Optic activation: ~70–100 °C
• Thermal-Weld activation: ~90–120 °C
• BioGen activation: ~70–100 °C
• Storage: 5–25 °C, dry, protected from light
• Shelf life: 12 months unopened

• Heat/light-assisted interlayer welding and micro-crack arrest
• Reduced layer-split and brittle fracture in high-resolution builds
• Maintains high stiffness and dimensional stability at use levels
• Low bleed-out
• Remains within the cured matrix
• Optical-friendly behavior for Optic and BioGen
• Strongest weld response for Thermal-Weld
• Optic version: high-clarity, low-odor self-repair with minimal print re-tuning
• Thermal-Weld version: robust hot-weld behavior for rigid/high-Tg matrices
• BioGen version: biogenic self-repair pathway with warm-to-moderate activation

• Stir under low light to full homogeneity before printing
• Print on 385–405 nm systems
• Re-optimize initial/per-layer exposure slightly versus baseline
• Align surfaces and apply light pressure during the thermal dwell, then cool in contact
• A brief localized 405 nm flash can be used to lock the healed interface
• Follow the host resin’s standard post-cure
• Designed for rigid/tough engineering photopolymers operating at 385–405 nm
• Suitable for clear and pigmented systems
• For highly filled/opaque matrices, validate exposure and activation on internal coupons
• Industrial/R&D use only
• Use standard PPE (gloves, goggles, lab coat) and adequate ventilation
• Avoid prolonged exposure to intense light during mixing/handling
• Consult SDS for this product and for the host resin
• Please keep resins away from natural or room light to prevent unintended curing

Activation guide is typical and must be validated on internal coupons. For highly filled or opaque matrices, validate exposure and activation on internal coupons.

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

This self-healing booster is supplied as a reactive additive for integration into rigid and tough engineering SLA, DLP and LCD photopolymers. Applications that require a dedicated rigid or high-stiffness formulation, or specific mechanical, thermal (high-Tg), optical or processing targets beyond what the additive provides on its own, can be addressed through a custom-designed material.

For these cases, 3Dresyns develops customized resin and additive systems according to customer specifications through the Customization Services program: Customization Services.

Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.

• Functional Additives
• Functional modifiers

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)