3D-ADD SH, Self-Heal temperature-targeted repair additives for 3D printing resins

3D-ADD SH are dynamic self-healing additives supplied in a 100% reactive, ultra-low-odor medium for SLA, DLP and LCD resins at 385–405 nm. They enable interlayer re-bonding, post-print repair, and cure-stress relaxation at defined activation temperatures.

Each grade is tuned so designers can select the right balance of mobility and toughness for their resin system. Available grades are SH-RT, SH-60, SH-80, SH-100 and SH-120, with extended grades SH-140 and SH-180 available on request.

Designed for use with SLA, DLP and LCD resin systems operating at 385–405 nm within industrial and R&D environments. Suitable for soft, delicate, optical, engineering and high-performance printed components requiring interlayer welding, post-print self-repair and stress relaxation.

• Interlayer welding and post-print self-repair of SLA, DLP and LCD printed parts
• Soft or delicate components and thin optics
• Optical and delicate functional parts
• General-purpose repair applications
• Engineering, higher-Tg and thermal-cycling parts

• Density (25 °C): ≈ 0.99–1.10 g/cm³ (ISO 1675)
• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Color (APHA): typically < 60 (clear grades) (ISO 6271)
• Appearance: Clear to pale-yellow liquid
• Viscosity: SH-RT/60 ≈ 300–700 mPas at 23°C ± 2°C (ISO 3219)
• Viscosity: SH-80 ≈ 500–900 mPas at 23°C ± 2°C (ISO 3219)
• Viscosity: SH-100 ≈ 700–1200 mPas at 23°C ± 2°C (ISO 3219)
• Viscosity: SH-120 ≈ 900–1500 mPas at 23°C ± 2°C (ISO 3219)
• Odor: Very low, neutral
• SH-RT activation: RT with light assist; 40–60 °C gentle assist
• SH-60 activation: 55–70 °C (10–30 min)
• SH-80 activation: 75–90 °C (10–20 min)
• SH-100 activation: 95–110 °C (10–20 min)
• SH-120 activation: 115–130 °C (10–20 min)
• Shelf life ≈ 12 months sealed
• Storage: 15–25 °C, dry and protected from light
• Delivery time is around 3–4 weeks after ordering

• Heat- or light-assisted interlayer welding and post-print self-repair
• Releases internal stress, minimizing micro-cracking and warpage
• Improves fatigue resistance and toughness in brittle matrices
• Optical-friendly at recommended use levels
• Low-yellowing design at typical loadings
• 100% reactive (no non-reactive solvents)
• Ready to use
• Mixes directly with standard UV-curable resins

• Dosage: 5–10 wt% into the host resin (typical 7–10%)
• For softer/flexible hosts, 3–5% may suffice
• For very brittle hosts, validate up to ~12%
• Stir under moderate agitation until homogeneous
• Temper to 40–50 °C if needed
• Degas before printing
• Protect from stray light
• Expect a slight increase in exposure vs. baseline; typical +5–15%
• Re-optimize initial and per-layer cures
• Align surfaces and apply the grade’s activation temperature for 10–30 min under light pressure
• For SH-RT, use room temperature with localized light-assist to lock the interface
• Follow the host resin’s standard UV post-cure after the repair cycle
• SLA/DLP/LCD systems operating at 385–405 nm
• Compatible with common 3D-resin matrices including rigid-tough, tough-clear, engineering clears and flexible systems
• Compatible with clear and pigmented formulations, verify in opaque/filled systems
• Use standard PPE (gloves, goggles, lab coat) and adequate ventilation
• Avoid prolonged exposure to strong light during mixing
• Consult the SDS for detailed handling information
• Please do not expose any 3D resins to natural or room light to prevent their curing

• 100% reactive
• Ultra-low-odor medium
• Added metals/amines: None
• For industrial and R&D use only
• Not evaluated for implantable, pharmaceutical, or food-contact applications unless stated in writing

Exact activation depends on host Tg, degree of cure, section thickness, and applied pressure. Validate on internal coupons. Use gentle pressure/clamping during dwell.

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

3D-ADD SH is supplied as a reactive self-healing additive for integration into SLA, DLP and LCD host resins across rigid, tough, engineering and flexible systems. Applications that require a dedicated repairable or self-healing formulation, a specific activation-temperature grade, or mechanical, thermal (high-Tg), optical or processing targets beyond what the additive provides on its own, can be addressed through a custom-designed material.

For these cases, 3Dresyns develops customized resin and additive systems according to customer specifications through the Customization Services program: Customization Services.

Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.

• Functional Additives
• Functional modifiers

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)