Description
Description
3D-ADD SH are dynamic self-healing additives supplied in a 100% reactive, ultra-low-odor medium for SLA, DLP, and LCD resins (385–405 nm). They enable interlayer re-bonding, post-print repair, and cure-stress relaxation at defined activation temperatures. Each grade is tuned so designers can select the right balance of mobility and toughness for their resin system.
Grades
SH-RT — Room-temperature / light-assist for soft or delicate components
SH-60 — ≈ 60 °C; optical & sensitive functional parts
SH-80 — ≈ 80 °C; general-purpose repair additive
SH-100 — ≈ 100 °C; for engineering and higher-Tg matrices
SH-120 — ≈ 120 °C; for high-performance, demanding applications
(Extended on request: SH-140 ≈ 140–150 °C; SH-180 ≈ 175–185 °C.)
Key Features & Benefits
Heat- or light-assisted interlayer welding and post-print self-repair
Releases internal stress, minimizing micro-cracking and warpage
Improves fatigue resistance and toughness in brittle matrices
Optical-friendly at recommended use levels
Low-yellowing design at typical loadings
100% reactive (no non-reactive solvents)
Ready to use; mixes directly with standard UV-curable resins
Typical Activation Guide
Grade Activation Window* Typical Use Case
SH-RT RT with light assist; 40–60 °C gentle assist Soft/delicate parts, thin optics
SH-60 55–70 °C (10–30 min) Optical & delicate functional parts
SH-80 75–90 °C (10–20 min) General-purpose
SH-100 95–110 °C (10–20 min) Engineering / higher-Tg matrices
SH-120 115–130 °C (10–20 min) High-performance, thermal-cycling parts
Exact activation depends on host Tg, degree of cure, section thickness, and applied pressure. Validate on internal coupons. Use gentle pressure/clamping during dwell.
How to Use
Dosage: 5–10 wt% into the host resin (typical 7–10%). For softer/flexible hosts, 3–5% may suffice; for very brittle hosts, validate up to ~12%.
Incorporation: Stir under moderate agitation until homogeneous; temper to 40–50 °C if needed; degas before printing; protect from stray light.
Printing: Expect a slight increase in exposure vs. baseline; typical +5–15%. Re-optimize initial and per-layer cures.
Repair Protocol: Align surfaces; apply the grade’s activation temperature for 10–30 min under light pressure. For SH-RT, use room temperature with localized light-assist to lock the interface.
Post-Cure: Follow the host resin’s standard UV post-cure after the repair cycle.
Typical Physical Properties (as supplied)
Appearance: Clear to pale-yellow liquid
Odor: Very low, neutral
Viscosity (25 °C): SH-RT/60 ≈ 300–700 mPa·s; SH-80 ≈ 500–900 mPa·s; SH-100 ≈ 700–1200 mPa·s; SH-120 ≈ 900–1500 mPa·s
Density (25 °C): ≈ 0.99–1.10 g/cm³
Color (APHA): typically < 60 (clear grades)
Added metals/amines: None
Compatibility
SLA/DLP/LCD systems operating at 385–405 nm
Common 3D-resin matrices (rigid-tough, tough-clear, engineering clears, flexible)
Clear and pigmented formulations (verify in opaque/filled systems)
Handling & Safety
Use standard PPE (gloves, goggles, lab coat) and adequate ventilation.
Avoid prolonged exposure to strong light during mixing.
Consult the SDS for detailed handling information.
Storage & Shelf Life
Store sealed at 15–25 °C, dry and protected from light. Shelf life ≈ 12 months sealed.
Regulatory & Intended Use
For industrial and R&D use only. Not evaluated for implantable, pharmaceutical, or food-contact applications unless stated in writing.
Kit Contents
It is supplied as a kit, which contains the product (and a 10 gram sample of 3D-ADD SHB1 Self-Heal Booster), one graduated beaker and one empty 250 mL black bottle to measure, mix, keep and protect the 3D resins from daylight. Please do not expose any 3D resins to natural or room light to prevent their curing.
IMPORTANT
The product has a guaranteed shelf life of 12 months, but in practice it has a longer shelf life. Its delivery time is around 3–4 weeks after ordering.