


3D-ADD SH, Self-Heal temperature-targeted repair additives for 3D printing resins
Product description
3D-ADD SH are dynamic self-healing additives supplied in a 100% reactive, ultra-low-odor medium for SLA, DLP and LCD resins at 385–405 nm. They enable interlayer re-bonding, post-print repair, and cure-stress relaxation at defined activation temperatures.
Each grade is tuned so designers can select the right balance of mobility and toughness for their resin system. Available grades are SH-RT, SH-60, SH-80, SH-100 and SH-120, with extended grades SH-140 and SH-180 available on request.
Application framework
Designed for use with SLA, DLP and LCD resin systems operating at 385–405 nm within industrial and R&D environments. Suitable for soft, delicate, optical, engineering and high-performance printed components requiring interlayer welding, post-print self-repair and stress relaxation.
Typical applications
- Interlayer welding and post-print self-repair of SLA, DLP and LCD printed parts
- Soft or delicate components and thin optics
- Optical and delicate functional parts
- General-purpose repair applications
- Engineering, higher-Tg and thermal-cycling parts
Measured physical properties
- Appearance: Clear to pale-yellow liquid
- Odor: Very low, neutral
- Viscosity (25 °C): SH-RT/60 ≈ 300–700 mPa·s
- Viscosity (25 °C): SH-80 ≈ 500–900 mPa·s
- Viscosity (25 °C): SH-100 ≈ 700–1200 mPa·s
- Viscosity (25 °C): SH-120 ≈ 900–1500 mPa·s
- Density (25 °C): ≈ 0.99–1.10 g/cm³
- Color (APHA): typically < 60 (clear grades)
- SH-RT activation: RT with light assist; 40–60 °C gentle assist
- SH-60 activation: 55–70 °C (10–30 min)
- SH-80 activation: 75–90 °C (10–20 min)
- SH-100 activation: 95–110 °C (10–20 min)
- SH-120 activation: 115–130 °C (10–20 min)
- Shelf life ≈ 12 months sealed
- Storage: 15–25 °C, dry and protected from light
- Delivery time is around 3–4 weeks after ordering
Functional performance characteristics
- Heat- or light-assisted interlayer welding and post-print self-repair
- Releases internal stress, minimizing micro-cracking and warpage
- Improves fatigue resistance and toughness in brittle matrices
- Optical-friendly at recommended use levels
- Low-yellowing design at typical loadings
- 100% reactive (no non-reactive solvents)
- Ready to use
- Mixes directly with standard UV-curable resins
Processing and handling performance
- Dosage: 5–10 wt% into the host resin (typical 7–10%)
- For softer/flexible hosts, 3–5% may suffice
- For very brittle hosts, validate up to ~12%
- Stir under moderate agitation until homogeneous
- Temper to 40–50 °C if needed
- Degas before printing
- Protect from stray light
- Expect a slight increase in exposure vs. baseline; typical +5–15%
- Re-optimize initial and per-layer cures
- Align surfaces and apply the grade’s activation temperature for 10–30 min under light pressure
- For SH-RT, use room temperature with localized light-assist to lock the interface
- Follow the host resin’s standard UV post-cure after the repair cycle
- SLA/DLP/LCD systems operating at 385–405 nm
- Compatible with common 3D-resin matrices including rigid-tough, tough-clear, engineering clears and flexible systems
- Compatible with clear and pigmented formulations, verify in opaque/filled systems
- Use standard PPE (gloves, goggles, lab coat) and adequate ventilation
- Avoid prolonged exposure to strong light during mixing
- Consult the SDS for detailed handling information
- It is supplied as a kit, which contains the product and a 10 gram sample of 3D-ADD SHB1 Self-Heal Booster, one graduated beaker and one empty 250 mL black bottle to measure, mix, keep and protect the 3D resins from daylight
- Please do not expose any 3D resins to natural or room light to prevent their curing
Chemical and safety characteristics
- 100% reactive
- Ultra-low-odor medium
- Added metals/amines: None
- For industrial and R&D use only
- Not evaluated for implantable, pharmaceutical, or food-contact applications unless stated in writing
Testing & processing disclaimer
Exact activation depends on host Tg, degree of cure, section thickness, and applied pressure. Validate on internal coupons. Use gentle pressure/clamping during dwell.
Disclaimer
This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.
3D-ADD SH is supplied as a reactive self-healing additive for integration into SLA, DLP and LCD host resins across rigid, tough, engineering and flexible systems. Applications that require a dedicated repairable or self-healing formulation, a specific activation-temperature grade, or mechanical, thermal (high-Tg), optical or processing targets beyond what the additive provides on its own, can be addressed through a custom-designed material.
For these cases, 3Dresyns develops customized resin and additive systems according to customer specifications through the Customization Services program: Customization Services.
This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.
Document reference: TDS-3D-ADD-SH-EN | Version: 1.0 | Last updated: March 2026
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