3Dresyn HTR-Silicone1, High Temperature Resistant Silicone

Product description

3Dresyn HTR-Silicone1 is a high temperature resistant silicone photopolymer designed for nano and micro fabrication workflows requiring soft and elastic performance, very high resolution, high optical clarity and resistance above 200ºC.

This UV and EB curable silicone soft and elastic photopolymer is intended for applications such as printing of soft and elastic stamps for nano imprinting lithography, soft and elastic negative photoresists for standard UV lithography and PCB technology processing, and UV patterning of core and cladding.

Application framework

Designed for use in nano and micro fabrication workflows, including photolithography and soft lithography, and printable by most commercial and professional SLA, DLP and LCD 3D printers.

Typical applications

• UV curable molds for soft lithography
• LED lighting encapsulation
• Power supplies
• Sensors
• Connectors
• Transformers
• Amplifiers
• Industrial controls
• High voltage resistors
• Relays
• Adhesive/encapsulant for solar cells
• Photocurable adhesive for integrated circuits during processing
• Cost effective transparent stamp fabrication, alternative to quartz stamps
• Mass sensors based on UV-NIL, ALD and RIE

Measured mechanical properties

• Tensile strength: <3 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <3 MPa (ISO 178)
• Young’s modulus: <7 MPa (ISO 527)
• Elongation at break: >100% (ISO 527)
• Shore hardness: A20-40 (ISO 868)

Measured physical properties

• Viscosity: <1000 mPas at 23°C ± 2°C (ISO 3219)
• Refractive index: 1.4-1.5
• Shrinkage: <0.1%
• Printing resolution: less than 10 nm
• Imprint temperature: 160ºC or higher

Functional performance characteristics

• High Temperature Resistant Silicone above 200ºC
• UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
• Electron beam EB curable
• Compatible and blendable with our 3Dresyns for nano and micro fabrication
• 100% foldable without breaking
• Medium soft and elastic
• Durable, higher resistance than PDMS
• Excellent balance of low viscosity for easy imprinting and low penetration
• Very high resolution
• High optical clarity
• High durability, non degradable as PDMS
• Excellent bonding, low risk of debonding
• Higher mechanical properties, with low risk of cracking vs PDMS
• Very low degassing at high vacuum
• Low oxygen sensitivity
• High mechanical stability
• Excellent spin coating application
• Excellent etching with Reactive Ion Etching
• Excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
• Low penetration
• Low surface tension with good release and demolding properties

Processing and handling performance

• Printable by most commercial and professional SLA, DLP & LCD 3D printers
• Long shelf life of 1 year
• No thermal treatment is required
• Easy processing with standard lithography equipment
• Easy removal of uncured resin with ketones, alcohols and esters
• Contains hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)

Chemical and safety characteristics

• Synthetic resin source
• Organo-tin free
• 100% organic, free of inorganic materials

Testing & processing disclaimer

This resin exhibits similar temperature resistance to conventional high temperature resistant silicones. It is custom made to order to meet customer printing and performance specifications.

Disclaimer

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Document reference: TDS-3DRESYN-HTR-SILICONE1-EN | Version: 1.0 | Last updated: March 2026