3Dresyn IM-UHT-WS High-Strength Rigid Water-Soluble Sacrificial Resin

Product description

3Dresyn® IM-UHT-WS is a high-strength rigid water-soluble sacrificial mold-making photopolymer developed for SLA, DLP and LCD mold-making workflows requiring dimensional stability, high mechanical resistance and thermal resistance during injection or casting.

Application framework

Designed for use in vat photopolymerization systems (SLA, DLP and LCD) within controlled professional environments. Suitable for the fabrication of water-soluble sacrificial molds requiring a high-strength rigid D90 profile with thermal resistance during injection and casting workflows.

Typical applications

• High-temperature injection molds
• Molds for ceramic injection molding (CIM)
• Molds for metal injection molding (MIM)
• Thermal-resistant sacrificial tooling

Measured mechanical properties

• Tensile strength: <55 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <55 MPa (ISO 178)
• Young’s modulus: <4000 MPa (ISO 527)
• Elongation at break: <2% (ISO 527)
• Shore hardness: D90 (ISO 868)

Measured physical properties

• Heat deflection temperature (HDT): <120 °C @ 0.45 MPa (ISO 75)
  
• Water solubility
• Very low shrinkage
• Viscosity: <100 mPas at 23°C ± 2°C (ISO 3219)

Functional performance characteristics

• High mechanical strength and rigidity (high-strength rigid D90 profile)
• Thermal resistance during injection and casting workflows
• Water solubility for post-process mold removal
• Very low shrinkage

Processing and handling performance

• Printable by SLA, DLP and LCD
• Stable under high temperature injection conditions
• Recommended printing temperature: 20–25 °C

Chemical and safety characteristics

• Metal-free
• Organo-tin free

Testing & processing disclaimer

Thermal performance depends on post-curing conditions. Validation required per application.

Disclaimer

This material is supplied as a professional manufacturing material and is not marketed as a finished product.

Document reference: TDS-IM-UHT-WS-EN | Version: 1.0 | Last updated: June 2026