3Dresyn IM-UHT-WS, ultra tough and water soluble for sacrificial medium temperature sacrificial injection molding

Product description

3Dresyn® IM-UHT-WS is a water-soluble high temperature photopolymer developed for sacrificial mold fabrication under extreme thermal conditions.

Application framework

Designed for SLA, DLP and LCD systems for high temperature injection workflows.

Typical applications

• High temperature injection molds
• CIM and MIM molds
• Thermal resistant sacrificial tooling

Measured mechanical properties

• Tensile strength: <55 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <55 MPa (ISO 178)
• Young’s modulus: <4000 MPa (ISO 527)
• Elongation at break: <2% (ISO 527)
• Shore hardness: D90 (ISO 868)

Measured physical properties

• Heat deflection temperature (HDT): <120 °C @ 0.45 MPa (ISO 75)
  
• Water solubility
• Very low shrinkage
• Viscosity: <100 mPas at 23°C ± 2°C (ISO 3219)

Functional performance characteristics

• Extreme thermal resistance
• High rigidity
• Water solubility
• Very low shrinkage

Processing and handling performance

• Printable by SLA, DLP and LCD
• Stable under high temperature injection conditions
• Recommended printing temperature: 20–25 °C

Chemical and safety characteristics

• Metal-free
• Organo-tin free

Testing & processing disclaimer

Thermal performance depends on post-curing conditions. Validation required per application.

Disclaimer

This material is supplied as a professional manufacturing material and is not marketed as a finished product.

Document reference: TDS-IM-UHT-WS-EN | Version: [X.X] | Last updated: [Month Year]