3Dresyn NMF T1 Bio, Biocompatible Tough photopolymer for nano and micro fabrication

3Dresyn NMF T1 Bio is a UV & EB curable organic tough photopolymer for nano and micro fabrication, including printing of tough stamps for Nano Imprinting Lithography NIL, tough negative photoresists for standard UV lithography and PCB technology processing, and UV patterning of core and cladding.

This resin exhibits properties in between quartz glass and PDMS and provides a combination of toughness, semi-rigidity, high optical clarity and very high resolution for nano and micro fabrication workflows.

Designed for nano and micro fabrication, UV lithography, PCB technology processing, Nano Imprinting Lithography NIL, spin coating, Reactive Ion Etching, wet and dry etching, and optical microfabrication workflows.

• Transparent tough stamp fabrication as an alternative to quartz or electroplated stamps
• Mass sensors based on UV-NIL, ALD and RIE
• Tough negative photoresists for standard UV lithography and PCB technology processing
• UV patterning of core and cladding

• Tensile strength: <40 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <40 MPa (ISO 178)
• Young’s modulus: >1500 MPa (ISO 527)
• Elongation at break: <10% (ISO 527)
• Shore hardness: D80 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Water absorption: (ISO 20795-1)
• Printing shrinkage: no measurable dimensional shrinkage after calibration under validated processing conditions
• Viscosity: optimized within the processing range required for the intended printing process and application
• Imprint temperature: >160ºC short term
• Printing resolution: less than 10 nm

• Refractive index: 1.45-1.55 (ISO 489)

• Resin with properties in between quartz glass and PDMS
• UV curable with excellent photoreactivity at 250-410 nm with minimum energy dosage
• Electron beam EB curable
• Compatible and blendable with our 3Dresyns for nano & micro fabrication
• Tough, semi rigid
• Durable
• High impact and shattering resistance
• High optical clarity
• High durability, non degradable
• Excellent bonding, low risk of debonding
• High mechanical properties, with low risk of cracking
• Very low degassing at high vacuum
• Low oxygen sensitivity
• High mechanical stability
• Low penetration
• Low surface tension with good release and demolding properties
• 100% organic free of inorganic materials
• Optionally it can contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane FDTS

• Excellent balance of low viscosity for easy imprinting and low penetration
• Long shelf life of 1 year
• Excellent spin coating application
• Excellent etching with Reactive Ion Etching
• Excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
• No thermal treatment is required
• Easy processing with standard lithography equipment
• Easy removal of uncured resin with ketones, alcohols and esters

• UV & EB curable organic photopolymer
• Biocompatible
• Synthetic resin source
• Organo-tin free

Final imprinting behavior, lithography behavior, etching performance, optical properties, substrate compatibility and processing performance must be validated by the user according to the intended application and processing conditions.

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)