3Dresyn TCR-Fluorosilicone1, Temperature and Chemical Resistant Fluorosilicone

3Dresyn TCR-Fluorosilicone1 is a temperature and chemical resistant fluorosilicone photopolymer designed for nano and micro fabrication workflows requiring soft and elastic performance, excellent chemical resistance to fuels and oils, very high resolution and high optical clarity.

This UV and EB curable soft and elastic photopolymer is intended for applications such as printing of soft and elastic stamps for nano imprinting lithography, soft and elastic negative photoresists for standard UV lithography and PCB technology processing, and UV patterning of core and cladding.

Designed for use in nano and micro fabrication workflows, including photolithography and soft lithography, and printable by most commercial and professional SLA, DLP and LCD 3D printers.

• UV curable molds for soft lithography
• LED lighting encapsulation
• Power supplies
• Sensors
• Connectors
• Transformers
• Amplifiers
• Industrial controls
• High voltage resistors
• Relays
• Adhesive/encapsulant for solar cells
• Photocurable adhesive for integrated circuits during processing
• Cost effective transparent stamp fabrication, alternative to quartz stamps
• Ideal for mass sensors based on UV-NIL, ALD and RIE

• Tensile strength: <3 MPa (ISO 527-1 / ISO 527-2)
• Flexural strength: <3 MPa (ISO 178)
• Young’s modulus: <7 MPa (ISO 527)
• Elongation at break: >100% (ISO 527)
• Shore hardness: A20-40 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Shrinkage: <0.1%
• Viscosity: <6000 mPas at 23°C ± 2°C (ISO 3219)
• Printing resolution: less than 10 nm (dependent on printting technology and resolution)
• Imprint temperature: 160ºC or higher

• Refractive index: 1.35-1.4

• Temperature and chemical resistant fluorosilicone
• Excellent chemical resistance to fuels and oils
• UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
• Electron beam EB curable
• Compatible and blendable with our 3Dresyns for nano and micro fabrication
• 100% foldable without breaking
• Medium soft and elastic
• Durable
• Excellent balance of low viscosity for easy imprinting and low penetration
• Very high resolution
• High optical clarity
• High durability
• Excellent bonding, low risk of debonding
• Very low degassing at high vacuum
• Low oxygen sensitivity
• High mechanical stability
• Excellent spin coating application
• Excellent etching with Reactive Ion Etching
• Superior stability and chemical resistance to a wide range of wet chemistries used in the clean room
• Low penetration
• Low surface tension with good release and demolding properties

• Printable by most commercial and professional SLA, DLP & LCD 3D printers
• Long shelf life of 1 year
• No thermal treatment is required
• Easy processing with standard lithography equipment
• Easy removal of uncured resin with ketones, alcohols and esters
• Contains Fluorine functionality

• Synthetic resin source
• Organo-tin free
• 100% organic, free of inorganic materials

This resin exhibits similar chemical resistance to conventional fluorosilicones. It is custom made to order to meet customer printing and performance specifications.

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)