3Dresyn TCR-Fluorosilicone1, Temperature and Chemical Resistant Fluorosilicone

3Dresyn TCR-Fluorosilicone1 has these features and benefits:

• Temperature and Chemical Resistant Fluorosilicone
• UV & EB curable silicone soft and elastic photopolymer for nano and micro fabrication (photolithography and softlithography), such as printing of soft and elastic stamps for Nano Imprinting lithography NIL and for soft & elastic negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
• excellent chemical resistance to fuels and oils 
• UV curable: excellent photoreactivity at 250-410 nm with medium energy dosage
• Electron beam EB curable
• compatible and blendable with our 3Dresyns for nano & micro fabrication  
• 100% foldable without breaking
• synthetic resin source
• Shore Hardness A20-40 range
• medium tensile strength, <3 MPa
• medium soft and elastic (Young modulus <7 MPa)
• elongation at yield >100%
• refractive index 1.35-1.4
• durable
• medium viscosity <6000 mPas
• excellent balance of low viscosity for easy imprinting and low penetration  
• very high resolution (printing resolution of less than 10 nm)
• very low shrinkage <0.1%
• printable by most commercial and professional SLA, DLP & LCD 3D printers
• organo-tin free
• high optical clarity
• high durability
• excellent bonding, low risk of debonding
• imprint Temperature 160ºC or higher 
• very low degassing at high vacuum 
• low oxygen sensitivity
• high mechanical stability
• long shelf life of 1 year
• excellent spin coating application 
• excellent etching with Reactive Ion Etching
• superior stability and chemical resistance to a wide range of wet chemistries used in the clean room
• low penetration
• low surface tension with good release and demolding properties
• 100% organic (free of inorganic materials) 
• contains Fluorine functionality
• no thermal treatment is required
• easy processing with standard lithography equipment
• easy removal of uncured resin with ketones, alcohols and esters

Applications

• UV curable molds for soft lithography
• LED lighting encapsulation
• power supplies
• sensors
• connectors
• transformers
• amplifiers
• industrial controls
• high voltage resistors
• relays
• adhesive/encapsulant for solar cells
• photocurable adhesive for integrated circuits during processing
• cost effective transparent stamp fabrication, alternative to quartz stamps
• ideal for mass sensors based on UV-NIL, ALD and RIE

Note: this resin exhibits similar chemical resistance to conventional fluorosilicones.  It is custom made to order to meet customer printing and performance specifications.