Debinding Solution DS1 Bio is a liquid debinder for cold eco debinding.
It has been developed to debind part of the SLS binder of 3Dresyn EPB1 SD Bio used for Cold Metal Fusion CMF, Cold Ceramic Fusion CCF & Cold Polymer Fusion CPF by dipping SLS 3D ceramic, metal, polymer, or exotic powder prints at 80-100ºC, 3Dresyn LMM RSB1 SD, and other solvent debindable materials.
Designed for cold eco debinding workflows of SLS ceramic, metal, polymer, or exotic powder prints, lithography-based metal manufacturing parts, and other solvent debindable materials by dipping at elevated temperature.
Final debinding performance depends on the binder system, part geometry, debinding time, temperature, and the complete manufacturing workflow. Suitability must be validated by the user for the intended application.
This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.
Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.
This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.
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