3Dresyn R140D90 ESD ultra rigid up to 140C, ESD compliant

This formulation is based on a synthetic resin system engineered to achieve high heat deflection performance while maintaining excellent printability, surface resolution and ESD compliance.

• Electronics manufacturing components
• Heat-resistant jigs and assembly aids
• Static-dissipative housings and enclosures
• Engineering parts requiring rigidity, thermal resistance and ESD control

• Tensile strength: >50 MPa (ISO 527)
• Flexural strength: >40 MPa (ISO 178)
• Young’s modulus: 2700–3100 MPa (ISO 527)
• Elongation at break: <2.5% (ISO 527)
• Shore hardness: D90 (ISO 868)

• Density: 0.90–1.20 g/cm³, depending on formulation and, where applicable, selected version (ISO 1675)
• Printing shrinkage: no measurable dimensional shrinkage after calibration under validated processing conditions
• Resolution capability: very high (process-dependent)
• Viscosity: <150 mPas at 23°C ± 2°C (ISO 3219)
• Low viscosity enabling fast recoating and stable processing
• Available colors: customizable

• Heat Deflection Temperature (HDT): up to 140°C @ 0.45 MPa (ISO 75)

• Surface resistivity: <10⁹ ohms (IEC 61340-2-3)
• Compliant with ESD standards: EN 61340, EN ISO 20344–20347

• Extra hard and rigid material behavior
• Moderate-to-high thermal resistance
• High dimensional stability
• Durable under static load conditions
• Medium impact and shattering resistance
• Very high resolution with fine feature capability

High Heat Deflection Temperature (HDT) photopolymer resins, despite their rigidity, may exhibit brittle behavior and reduced lifetime under prolonged thermal exposure. For applications requiring long-term durability at elevated temperatures, alternative materials such as machined polyimide, or injection-molded PolyAmide Imide (PAI) or similar high-performance polymers, should be considered.

• Printing technologies: SLA, DLP and LCD
  
• Compatible with most commercial and professional systems when properly calibrated
• Increased durability of the resin tank during printing

• Biocompatible (final part validation required)
• Synthetic resin base
• Organo-tin free formulation

Material properties are measured under controlled laboratory conditions and may vary depending on printer type, exposure conditions, layer thickness, build orientation and post-processing workflow.

This material is supplied as a professional manufacturing material for engineering and prototyping workflows. It is not marketed as a finished product. Final part performance and suitability must be validated by the user according to the intended application.

Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.

• Electrically Conductive 3D Printing Resins
• ESD 3D resins

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)