3Dresyn UDP-LDT WS Universal Low Debinding Temperature & Water Soluble 3D resin for printing, debinding and sintering ceramic, metal, polymer and exotic powders

3Dresyn® UDP-LDT WS is a universal low debinding temperature and water-soluble photopolymer binder system designed for additive manufacturing of ceramic, metal, polymer and exotic powder-loaded formulations.

The material enables high powder loading, efficient dispersion and controlled debinding through combined water solubility and low-temperature thermal decomposition.

Designed for use in vat photopolymerization systems (SLA and DLP) for the fabrication of powder-filled green bodies intended for subsequent debinding and sintering processes.

• Ceramic additive manufacturing (CIM)
• Metal additive manufacturing (MIM)
• Polymer and composite powder processing
• Exotic and nano-powder-based systems
• Indirect additive manufacturing via casting or injection molding

• Elongation: <10% (ISO 527-1 / ISO 527-2)

• Low viscosity with good flow behavior (internal method)
• Viscosity: optimized within the processing range required for the intended printing process and application; good flow behavior

• Universal binder system for ceramic, metal, polymer and exotic powders
• High wetting and dispersibility of micron and submicron powders
• Supports powder loading up to ~50 vol%
• Fast debinding via combined water dissolution and thermal decomposition
• Partial oxidation capability with oxidizing agents for advanced debinding strategies
• Low expansion coefficient to minimize micro-fracture formation
• High resolution and detail reproduction

• Debinding temperature: ~180–220°C (partial binder decomposition)
• High resolution: up to ~20 µm (process-dependent)
• Controlled shrinkage depending on powder loading (process-dependent)

• Printable by SLA and DLP 3D printers
• Water-cleanable prints
• Water-soluble binder system for simplified debinding workflows
• Compatible with wavelengths up to 410 nm (and higher upon request)
• Improved adhesion when used with 3Dresyn AP1 Adhesive Primer
• Increased durability of the resin tank
• Organo-tin free formulation
• Compatible with Cleaning Fluid WS1 Bio for cleaning and post-processing

Material performance depends strongly on powder type, particle size distribution, loading fraction, printer settings, and debinding/sintering protocol. Final properties and dimensional accuracy must be validated under the intended workflow conditions.

• Universal binder platform for multiple powder systems
• Low-temperature debinding (~180–220°C)
• Fast debinding via water solubility
• High powder loading capability
• Excellent dispersion of micro and nano powders
• High resolution and controlled shrinkage

This material is supplied as a professional manufacturing material and is not marketed as a finished product. Final part performance, debinding, sintering behavior and process validation remain the responsibility of the user.

Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.

• Direct printing of sintering ceramics, metals, and exotic materials
• Powder Binders for SLS Cold Metal, Ceramic, Polymer & Exotic Materials Fusion

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)