Description
3Dresyn Polyimide SPI1 has these features and benefits:
- Sinterable Polyimide SPI 3D resin binder printable with SLA, DLP and LCD printers
- designed for water debinding and with low decomposition temperature
- orange yellow finishing
- 30% of polyimide powder of Low Viscosity LV version
- 35% of polyimide powder of High Viscosity HV version
- ideal for direct printing of ultra high temperature resistant Polyimide with temperature resistance up to 350ºC without the need of pressure as conventional hot compression moulding
- water/chemical and low temperature debinding and sintering at 360ºC
- excellent chemical resistance to most chemicals, including strong oxidizing and reducing agents and strong acids and alkalis
- very high mechanical strength
- very high impact resistance
- very high creep resistance even at elevated temperatures
- low friction coefficient <0.2 for reduced abrasion
- high resolution up to 20 microns
- controlled reproducible and isotropic shrinkage after sintering
- shrinkage % depends of product version and % PI powder concentration which depends on printer specifications and printing temperature
- printable with high power SLA, DLP & LCD 3D printers
- recommended power >15 mW/cm2 at 365, 385, or 405 nm
- Curing rate table at 9 mW/cm2 at 405 nm:
- 5, 10, 15, 20 seconds: <5-10 microns
- 25, 30 seconds: 10-15 microns
- 50 seconds: 15-20 microns
- 75 seconds. 25-30 microns
- 100 seconds: 30-32 microns
- debinding and sintering need to be tuned by customers to their specs
Typical properties after sintering
- Tensile modulus 360 MPa ISO 527-1/-2
- Stress at break <140 MPa ISO 527-1/-2
- Strain at break <10% ISO 527-1/-2
- Tensile creep modulus, 1h 3400 MPa ISO 899-1
- Tensile creep modulus,1000h 2700 MPa ISO 899-1
- Charpy impact strength, +23°C 122C kJ/m² ISO 179/1eU
- Charpy notched impact strength, +23°C 7C kJ/m² ISO 179/1eA
- Shore hardness D 90 ISO 7619-1
- Glass transition temperature, 10°C/min 335-340ºC ISO 11357-1/-2
- Temp. of deflection under load, 1.80 MPa 320°C ISO 75-1/-2
- Temp. of deflection under load, 0.45 MPa 340°C ISO 75-1/-2
- Coeff. of linear therm. expansion, parallel 41 E-6/K ISO 11359-1/-2
- Relative permittivity, 100Hz 3.5 IEC 62631-2-1
- Relative permittivity, 1MHz 3.4 IEC 62631-2-1
- Dissipation factor, 1MHz 80 E-4 IEC 62631-2-1
- Volume resistivity>1E13 Ohm*m IEC 62631-3-1
- Electric strength 34 kV/mm IEC 60243-1
- Density 1380 kg/m³ ISO 1183
Debinding and sintering*:
- 1st step: water/chemical debinding and 2nd step: thermal debinding at T=180-220ºC
- part of the binder has higher decomposition temperature than T=180-220ºC with good water solubility for fast debinding. It oxidises into small volatile molecules with oxidizers e.g. Potassium permanganate acidic water solutions
- part of the binder has low decomposition temperature c.180-220C, which is ideal for relatively low temperature debinding
- the overall binder system exhibits very fast debinding with water at room and at relatively low debinding temperature c.180-220ºC
- 3rd step: sintering at 350-380ºC to yield pure sintered polyimide materials
*Note: the final debinding and sintering cycle needs to be custom designed by customers to meet their process specifications; including their optimum debinding and sintering time, wihch depends on the thickness of prints, etc. The higher the dipping time and temperature the faster and higher the debinding degree, which depends on wall thickness and surface area. The thermal debinding can be increased from room temperature to 180-220ºC gradually to prevent any cracking. The longer the time the better. It depends on wall thickness. Keep prints at 180-220ºC from 30 min to 1-2 hours. From 220ºC increase the temperature gradually to 360ºC. The higher the thickness the slower the ramp. The sintering time is 2-3 hours at 360ºC.
