3Dresyn R190D90 ESD ultra rigid up to 190C, ESD compliant

Product description

3Dresyn® R190D90 ESD is an extra hard, high-temperature resistant photopolymer formulation with integrated electrostatic discharge (ESD) properties, designed for advanced engineering applications in SLA, DLP and LCD 3D printing workflows. The material combines very high rigidity, dimensional stability and elevated thermal resistance with controlled electrical conductivity for ESD-safe environments.

This formulation is based on a synthetic resin system engineered to achieve high heat deflection performance while maintaining excellent printability, surface resolution and ESD compliance.

Application framework

Designed for use in vat photopolymerization systems (SLA, DLP and LCD) within professional and industrial environments requiring ESD-safe, high-temperature and structurally demanding components.

Typical applications

• ESD-safe tooling and fixtures
• Electronics manufacturing components
• Heat-resistant jigs and assembly aids
• Static-dissipative housings and enclosures
• Engineering parts requiring rigidity, thermal resistance and ESD control

Measured mechanical properties

• Tensile strength: >50 MPa (ISO 527)
• Flexural strength: >40 MPa (ISO 178)
• Young’s modulus: 3500–4000 MPa (ISO 527)
• Elongation at break: <2% (ISO 527)
• Shore hardness: D90 (ISO 868)

Thermal properties

• Heat Deflection Temperature (HDT): up to 190°C @ 0.45 MPa

Electrical properties

• Surface resistivity: <10⁹ ohms
• Compliant with ESD standards: EN 61340, EN ISO 20344–20347

Measured physical properties

• Viscosity: <300 mPa·s at 25 °C
• Shrinkage: very low (typical)
• Resolution capability: very high (process-dependent)
• Available colors: customizable

Functional performance characteristics

• Extra hard and rigid material behavior
• Integrated ESD-safe performance
• High thermal resistance for elevated temperature operation
• High dimensional stability
• Durable under static load conditions
• Medium impact and shattering resistance
• Very high resolution with fine feature capability

Processing and handling performance

• Printing technologies: SLA, DLP and LCD
• Compatible with most commercial and professional systems when properly calibrated
• Very low viscosity enabling fast recoating and stable processing
• Increased durability of the resin tank during printing

Chemical and safety characteristics

• Biocompatible (final part validation required)
• Synthetic resin base
• Organo-tin free formulation

Thermal performance note

High Heat Deflection Temperature (HDT) photopolymer resins, despite their rigidity, may exhibit brittle behavior and reduced lifetime under prolonged thermal exposure. For applications requiring long-term durability at high temperatures, alternative materials such as machined polyimide, or injection-molded PolyAmide Imide (PAI) or similar high-performance polymers, should be considered.

Testing & processing disclaimer

Material properties are measured under controlled laboratory conditions and may vary depending on printer type, exposure conditions, layer thickness, build orientation and post-processing workflow.

Disclaimer

This material is supplied as a professional manufacturing material for engineering and prototyping workflows. It is not marketed as a finished product. Final part performance and suitability must be validated by the user according to the intended application.

Document reference: TDS-R190D90-ESD-EN | Version: 1.0 | Last updated: March 2026