Description
Product Description
Self-healing booster engineered for rigid and tough photopolymers (SLA/DLP/LCD, 385–405 nm). It builds a reversible bonding network that enables local micro-welding of cracks and stronger interlayer fusion after a short activation, while preserving high stiffness and dimensional stability in service. Three tuned versions: Optic (high clarity, low odor), Thermal-Weld (strongest hot-weld), and BioGen (biogenic positioning with warm-press activation).
Versions
Optic — High-clarity, low-odor self-repair with minimal print re-tuning; optical-friendly at recommended levels.
Thermal-Weld — Robust hot-weld behavior for rigid/high-Tg matrices; ideal where joint integrity is critical.
BioGen — Biogenic self-repair pathway supporting sustainability narratives with warm-to-moderate activation.
Key Features & Benefits
Heat/light-assisted interlayer welding and micro-crack arrest.
Reduced layer-split and brittle fracture in high-resolution builds.
Maintains high stiffness and dimensional stability at use levels.
Low bleed-out; remains within the cured matrix.
Optical-friendly behavior (Optic/BioGen); strongest weld response (Thermal-Weld).
Typical Applications
Functional housings and covers, jigs/fixtures/tooling, snap-fits and brackets prone to stress whitening or brittle failure, precision rigid parts requiring reliable layer adhesion.
Recommended Use Level
5–15 wt% in rigid/tough resins. Around 5% primarily improves layer fusion and crack suppression; 10–15% enables visible weld-back of micro-cracks after activation. Select the version to match your requirement: Optic for optical cleanliness, Thermal-Weld for maximum hot-weld, BioGen for renewable-content programs.
Processing & Activation
Stir under low light to full homogeneity before printing.
Print on 385–405 nm systems; re-optimize initial/per-layer exposure slightly versus baseline.
Activation guide (typical, validate on internal coupons): Optic ~70–100 °C; Thermal-Weld ~90–120 °C; BioGen ~70–100 °C. Align surfaces, apply light pressure during the thermal dwell, then cool in contact. A brief localized 405 nm flash can be used to lock the healed interface. Follow the host resin’s standard post-cure.
Typical Properties (as supplied)
Appearance: pale yellow to light amber, clear.
Odor: very low.
Viscosity (25 °C): ~400–800 mPa·s (vat-friendly).
Density (25 °C): ~1.10–1.20 g·cm⁻³.
VOC: 0%.
Compatibility
Designed for rigid/tough engineering photopolymers operating at 385–405 nm; suitable for clear and pigmented systems. For highly filled/opaque matrices, validate exposure and activation on internal coupons.
Safety & Handling
Industrial/R&D use only. Use standard PPE (gloves, goggles, lab coat) and adequate ventilation. Avoid prolonged exposure to intense light during mixing/handling. Consult SDS for this product and for the host resin.
Storage & Shelf Life
Store tightly closed, 5–25 °C, dry, protected from light. Shelf life: 12 months unopened.
What’s Included (kit)
Additive, one graduated beaker, and one empty 250 mL black bottle to measure, mix, and protect the resin from daylight. Please keep resins away from natural or room light to prevent unintended curing.