3D-ADD Self-Heal Rigid — Optic · Thermal-Weld · BioGen

Product description

Self-healing booster engineered for rigid and tough photopolymers for SLA, DLP and LCD printing at 385–405 nm.

It builds a reversible bonding network that enables local micro-welding of cracks and stronger interlayer fusion after a short activation, while preserving high stiffness and dimensional stability in service. Three tuned versions are described: Optic, Thermal-Weld and BioGen.

Application framework

Designed for use with rigid and tough engineering photopolymers operating at 385–405 nm in SLA, DLP and LCD systems. Suitable for clear and pigmented systems requiring improved interlayer welding, crack arrest and self-healing behavior.

Typical applications

• Functional housings and covers
• Jigs, fixtures and tooling
• Snap-fits and brackets prone to stress whitening or brittle failure
• Precision rigid parts requiring reliable layer adhesion

Measured physical properties

• Appearance: pale yellow to light amber, clear
• Odor: very low
• Viscosity (25 °C): ~400–800 mPa·s
• Density (25 °C): ~1.10–1.20 g·cm⁻³
• VOC: 0%
• Recommended use level: 5–15 wt% in rigid/tough resins
• Optic activation: ~70–100 °C
• Thermal-Weld activation: ~90–120 °C
• BioGen activation: ~70–100 °C
• Storage: 5–25 °C, dry, protected from light
• Shelf life: 12 months unopened

Functional performance characteristics

• Heat/light-assisted interlayer welding and micro-crack arrest
• Reduced layer-split and brittle fracture in high-resolution builds
• Maintains high stiffness and dimensional stability at use levels
• Low bleed-out
• Remains within the cured matrix
• Optical-friendly behavior for Optic and BioGen
• Strongest weld response for Thermal-Weld
• Optic version: high-clarity, low-odor self-repair with minimal print re-tuning
• Thermal-Weld version: robust hot-weld behavior for rigid/high-Tg matrices
• BioGen version: biogenic self-repair pathway with warm-to-moderate activation

Processing and handling performance

• Stir under low light to full homogeneity before printing
• Print on 385–405 nm systems
• Re-optimize initial/per-layer exposure slightly versus baseline
• Align surfaces and apply light pressure during the thermal dwell, then cool in contact
• A brief localized 405 nm flash can be used to lock the healed interface
• Follow the host resin’s standard post-cure
• Designed for rigid/tough engineering photopolymers operating at 385–405 nm
• Suitable for clear and pigmented systems
• For highly filled/opaque matrices, validate exposure and activation on internal coupons
• Industrial/R&D use only
• Use standard PPE (gloves, goggles, lab coat) and adequate ventilation
• Avoid prolonged exposure to intense light during mixing/handling
• Consult SDS for this product and for the host resin
• Additive, one graduated beaker, and one empty 250 mL black bottle to measure, mix, and protect the resin from daylight are included in the kit
• Please keep resins away from natural or room light to prevent unintended curing

Chemical and safety characteristics

• VOC: 0%

Testing & processing disclaimer

Activation guide is typical and must be validated on internal coupons. For highly filled or opaque matrices, validate exposure and activation on internal coupons.

Disclaimer

This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.

Document reference: TDS-3D-ADD-SH-RIGID-TOUGH-EN | Version: 1.0 | Last updated: March 2026