3Dresyn UDP-LDT WS Universal Low Debinding Temperature & Water Soluble 3D resin for printing, debinding and sintering ceramic, metal, polymer and exotic powders

SKU: P20200

Size: 1000 grams
Free samples of Fine Tuner FT1 & LB1 will be sent if necessary for adjusting speed and resolution
The curing rate table provides the thickness of the chosen 3D resin cured at a light power similar to your DLP/LCD printer at 405 nm at 5, 10, 15, 20, 25, 50, 75, and 100 seconds
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Sale price€476.00

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Description

3Dresyn UDP-LDT WS has these features and benefits:

  • Universal Low Debinding Temperature & Water Soluble 3D resin for printing, debinding and sintering ceramic, metal, polymer, and exotic micron and submicron nano powders
  • higher wetting and dispersing yield than its benchmark Ceramic 3Dresyn CDP-LDT WS
  • ideal for low sintering temperature materials, including ceramic, metal, polymer, and exotic powders since debinding can be achieved at 180-220ºC 
  • part of the 3D resin has low decomposition temperature c. 180-220C, which is ideal for relatively low temperature debinding
  • part of the 3D resin has higher decomposition temperature but exhibits good water solubility for fast debinding with cold or hot water 
  • part of the 3D resin is easy to oxidise into small volatile molecules with oxidizers e.g. with Potassium permanganate acidic solutions
  • the overall 3D resin system exhibits very fast debinding with water at room and at relatively low debinding temperature c.180-220ºC 
  • excellent dispersability and flow of post added micron and submicron ceramic, metal, polymer, and exotic powders such as polyimide
  • powder additions can be up to 50% volume concentrations 
  • water cleanable prints and water soluble binder for improved debinding with water
  • very high resolution 3D printing for very high detail and resolution applications
  • high print quality and speed with curing wavelengths up to 410 nm and higher upon request
  • controlled and reproducible process shrinkage which depends on final % powder and resin binder
  • minimum expansion coefficient to prevent micro-fractures
  • elongation <10%
  • relative low viscosity, good flow
  • very high resolution of 20 microns of final products
  • low shrinkage
  • printable by SLA DLP 3D printers
  • can also be used as casting binder for indirect additive manufacturing via injection molding 
  • increased durability of the resin tank
  • organo-tin free
  • used in combination with our Adhesive Primer 3Dresyn AP1 for promoting adhesion on the build platform when high powder loads are used
  • clean and postcure your 3D prints with Cleaning Fluid WS1 Bio

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