3Dresyn UDP-LDT WS Universal Low Debinding Temperature & Water Soluble 3D resin for printing, debinding and sintering ceramic, metal, polymer and exotic powders

Product description

3Dresyn® UDP-LDT WS is a universal low debinding temperature and water-soluble photopolymer binder system designed for additive manufacturing of ceramic, metal, polymer and exotic powder-loaded formulations.

The material enables high powder loading, efficient dispersion and controlled debinding through combined water solubility and low-temperature thermal decomposition.

Application framework

Designed for use in vat photopolymerization systems (SLA and DLP) for the fabrication of powder-filled green bodies intended for subsequent debinding and sintering processes.

Typical applications

• Ceramic additive manufacturing (CIM)
• Metal additive manufacturing (MIM)
• Polymer and composite powder processing
• Exotic and nano-powder-based systems
• Indirect additive manufacturing via casting or injection molding

Measured / functional properties

• Debinding temperature: ~180–220°C (partial binder decomposition)
• Elongation: <10% (ISO 527-1 / ISO 527-2)
• Low viscosity with good flow behavior (internal method)
• High resolution: up to ~20 µm (process-dependent)
• Controlled shrinkage depending on powder loading (process-dependent)

Functional performance characteristics

• Universal binder system for ceramic, metal, polymer and exotic powders
• High wetting and dispersibility of micron and submicron powders
• Supports powder loading up to ~50 vol%
• Fast debinding via combined water dissolution and thermal decomposition
• Partial oxidation capability with oxidizing agents for advanced debinding strategies
• Low expansion coefficient to minimize micro-fracture formation
• High resolution and detail reproduction

Processing and handling performance

• Printable by SLA and DLP 3D printers
• Water-cleanable prints
• Water-soluble binder system for simplified debinding workflows
• Compatible with wavelengths up to 410 nm (and higher upon request)
• Improved adhesion when used with 3Dresyn AP1 Adhesive Primer
• Increased durability of the resin tank
• Organo-tin free formulation
• Compatible with Cleaning Fluid WS1 Bio for cleaning and post-processing

Testing & processing disclaimer

Material performance depends strongly on powder type, particle size distribution, loading fraction, printer settings, and debinding/sintering protocol. Final properties and dimensional accuracy must be validated under the intended workflow conditions.

Why choose 3Dresyn® UDP-LDT WS

• Universal binder platform for multiple powder systems
• Low-temperature debinding (~180–220°C)
• Fast debinding via water solubility
• High powder loading capability
• Excellent dispersion of micro and nano powders
• High resolution and controlled shrinkage

Regulatory & legal notice

This material is supplied as a professional manufacturing material and is not marketed as a finished product. Final part performance, debinding, sintering behavior and process validation remain the responsibility of the user.

Document reference: TDS-UDP-LDT-WS-EN | Version: 1.0 | Last updated: March 2026