High temperature vacuum samples and adapters for Atomic Layer Deposition (ALD) and Reactive Ion Etching (RIE) can be printed with our  ready to use and custom designed photopolymer 3D resins for printing mechanically resistant stamps and negative photoresists for nano & micro fabrication with photolithography technologies such as UV & EB Nanoimprint Lithography NIL.

Features of stamps and negative photoresists printed with our UV & EB nano & micro fabrication 3Dresyns NMF:

  • excellent photoreactivity at 10-410 nm and by electron beam EB with minimum energy dosage
  • high optical transparency
  • high durability and tear resistance, non degradable and mechanically delicate and permeable as PDMS
  • excellent bonding, low risk of debonding
  • high mechanical properties, with low risk of cracking, tearing and deforming
  • very high resolution (printing resolution of less than 10 nm)
  • high deflection temperature without thermoplasticity for ultra rigid grades
  • high temperature resistance for some grades
  • availability of versions with low and high Young´s modulus for custom control of mechanical properties
  • very low degassing at high vacuum 
  • low oxygen sensitivity
  • high mechanical stability
  • long shelf life of 1 year
  • excellent spin coating application 
  • excellent balance of low viscosity for easy imprinting and low penetration  
  • excellent etching with Reactive Ion Etching
  • excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
  • low penetration
  • low surface tension with good release and demolding properties
  • 100% organic (free of inorganic materials) 
  • contain hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
  • no thermal treatment is required
  • easy processing with standard lithography equipment
  • easy removal of uncured resin with ketones, alcohols and esters such as ethanol, acetone, ethylacetate, etc.


  • cost effective production of transparent photocurable stamp and negative photoresists
  • ideal for mass sensors based on UV-NIL, ALD and RIE
  • ideal for mechanical resonators with reduced dampening of piezoelectric actuators (ultra hard and rigid grades)
  • photocurable adhesives for integrated circuits during processing

Typically, two conventional materials are used for printing stamps:

  • Soft and flexible  stamps printed with PDMS
  • Hard and rigid stamps printed with quartz glass-like polymers

Both materials tend to break (tear) in the debonding process.

  • hard materials tend to suffer cracking due to excessive rigidity and britleness, while
  • soft materials like PDMS may suffer fast degradation and absorb the polymer resulting in high internal forces, even after using debonding layers on the stamps. They may suffer distorsion and deformation due to excessive softness with certain thin and high patterns

Discover our UV&EB resins for nano & micro fabrication with mechanical properties similar to glass, PDMS (and intermediate), used as photocurable  by UV & EB spin coatings for the fabrication of transparent soft and hard polymer stamps, used in photolithography technologies, such as UV & EB Nanoimprint Lithography and Soft Lithography.

Contact us to consult about our 3Dresyns for nano & micro fabrication (UV & EB nano imprinting) and your specific performance goals at: info@3Dresyns.com