3Dresyn TPU-like Urethane Flexible Elastic Engineering Resin

3Dresyn® TPU-like is a flexible photopolymer engineered to replicate the mechanical behaviour of thermoplastic polyurethane (TPU), offering a balance between elasticity, toughness and moderate stiffness. The material exhibits foldable behaviour with shape memory and recovery, particularly at low thicknesses, making it suitable for flexible functional components. It provides excellent optical clarity with minimal yellowing and ultra low water absorption. It is available in HV (higher mechanical performance) and LV (lower viscosity) versions for compatibility with SLA, DLP and LCD printing systems.

Intended for professional use in vat photopolymerization (SLA, DLP and LCD) additive manufacturing.
Final suitability of printed parts must be validated by the user according to the specific application, processing conditions and applicable regulatory requirements.

• Flexible engineering components and protective elements
• Shock-absorbing and impact-resistant parts
• Soft-touch surfaces and ergonomic components
• Seals, gaskets and flexible connectors
• Biomedical and food-contact oriented applications (subject to validation)

• Tensile strength: <40 MPa (typical) (ISO 527-1 / ISO 527-2)
• Flexural strength (break): <40 MPa (typical) (ISO 178)
• Young’s modulus: <900 MPa (typical) (ISO 527-1 / ISO 527-2)
• Elongation at break: ~30–50% (typical) (ISO 527-1 / ISO 527-2)
• Impact resistance (Notched Izod): >70 J/m (typical) (ISO 180)
• Shore hardness: D60–70 (ISO 868)

• Density: ~1.0–1.1 g/cm³ (typical) (ISO 1675)
• Water absorption: ultra low (ULWA ≤32 µg/mm³) (ISO 62)
• Water solubility: ≤1.6 µg/mm³
• Printing shrinkage: no measurable dimensional shrinkage after calibration under validated processing conditions
• Resolution capability: up to 20 µm (process-dependent)
• Color: clear, non-yellowing unless color is added
• Hydrophobic behaviour

• Glass transition temperature (Tg): ~25 °C (typical) (ISO 11357-2)

• Printing technologies: SLA, DLP and LCD
• Wavelength range: 385–405 nm
• Compatible with open-parameter vat photopolymerization systems
• LV (~<10,000 cP @ 25 °C): optimized for unheated printers or ambient temperatures below ~25 °C
• HV (~higher viscosity): optimized for heated systems and improved mechanical performance
• Follow 3Dresyns IFU for exposure, washing and post-curing to achieve target properties

• Biocompatible formulation platform
• Food-contact oriented formulation (subject to application-specific validation)
• Biocompatibility must be evaluated on the final printed and post-processed device according to ISO 10993
• Manufacturing aligned with ISO 13485 quality management systems
• Organo-tin free formulation

Material properties are measured on printed and post-processed specimens and may vary depending on the selected material version, printer type, printing parameters, build orientation, post-curing conditions and test specimen preparation. Reported values are indicative and provided for reference only.

• TPU-like balance of flexibility, toughness and moderate stiffness
• Good elasticity with shape memory and recovery
• High impact resistance for shock-absorbing applications
• Excellent clarity with minimal yellowing
• Ultra low water absorption (ULWA) and hydrophobic behaviour
• Food-contact and biomedical-oriented formulation platform (validation required)
• Very low shrinkage and good dimensional stability
• Available in LV and HV versions for broader processing flexibility
• Open-system compatibility (385–405 nm) across SLA/DLP/LCD workflows

For TPU-like 3D printing applications, compare adjacent flexible engineering resin routes when the required balance of elasticity, toughness, stiffness and shape recovery changes.

• Engineering & Functional 3D Resins
• 3Dresyn PP-like
• 3Dresyn HDPE-like

This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.

Access the 3Dresyns® Technical Resources (IFU, calibration, CRT, post-processing and troubleshooting)