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3Dresyn Polyimide SPI1, Sinterable Polyimide resin with ultra high temperature resistance

Regular price 400.00 €

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3Dresyn Polyimide SPI1 has these features and benefits:

  • Sinterable Polyimide 3D resin binder printable with SLA, DLP and LCD printers for water debinding and with low decomposition temperature 
  • ideal for direct printing of ultra high temperature resistant Polyimide with temperature resistance up to 350ºC without the need of pressure as conventional hot compression moulding
  • water/chemical and low temperature debinding and sintering at 360ºC
  • excellent chemical resistance to most chemicals, including strong oxidizing and reducing agents and strong acids and alkalis
  • very high mechanical strength
  • very high impact resistance
  • very high creep resistance even at elevated temperatures
  • low friction coefficient <0.2 for reduced abrasion
  • high resolution up to 20 microns
  • controlled reproducible and isotropic shrinkage after sintering
    • shrinkage % depends of version and printer specifications
  • printable by SLA, DLP & LCD 3D printers

Typical properties after sintering

  • Tensile modulus               3581      MPa      ISO 527-1/-2
  • Stress at break  140         MPa      ISO 527-1/-2
  • Strain at break  9.7          %            ISO 527-1/-2
  • Tensile creep modulus, 1h           3390      MPa      ISO 899-1
  • Tensile creep modulus, 1000h    2730      MPa      ISO 899-1
  • Charpy impact strength, +23°C  122C      kJ/m²    ISO 179/1eU
  • Charpy notched impact strength, +23°C 7C           kJ/m²    ISO 179/1eA
  • Shore D hardness, 15s   90           -              ISO 7619-1
  • Glass transition temperature, 10°C/min 337         °C           ISO 11357-1/-2
  • Temp. of deflection under load, 1.80 MPa           319         °C            ISO 75-1/-2
  • Temp. of deflection under load, 0.45 MPa           343         °C            ISO 75-1/-2
  • Coeff. of linear therm. expansion, parallel           41           E-6/K     ISO 11359-1/-2
  • Relative permittivity, 100Hz        3.5          -              IEC 62631-2-1
  • Relative permittivity, 1MHz         3.4          -              IEC 62631-2-1
  • Dissipation factor, 1MHz              80           E-4         IEC 62631-2-1
  • Volume resistivity           >1E13    Ohm*m               IEC 62631-3-1
  • Electric strength              34           kV/mm IEC 60243-1
  • Density 1380      kg/m³    ISO 1183

Debinding and sintering:

  • 1st step: water/chemical debinding and 2nd step: thermal debinding at T=180-220ºC 
    • part of the binder 
    • part of the binder has higher decomposition temperature than T=180-220ºC   but exhibits good water solubility for fast debinding and oxidises into small volatile molecules with oxidizers e.g. Potassium permanganate acidic water solutions
    • part of the binder has low decomposition temperature c.180-220C, which is ideal for relatively low temperature debinding
    • the overall binder system exhibits very fast debinding with water at room and at relatively low debinding temperature c.180-220ºC 
  • 3rd step: sintering at 350-380ºC to yield pure sintered polyimide materials

      * Our 3Dresyns have been designed to print in a broad range of printer settings. Nevertheless, our Print Quality Fine Tuners are recommended to fine tune our 3Dresyns to your specific printer settings. For more info click here.