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3Dresyn Polyimide SPI1, Sinterable Polyimide resin with ultra high temperature resistance

Regular price 375.00 €

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3Dresyn Polyimide SPI1 has these features and benefits:

  • Sinterable Polyimide PI 3D resin binder printable with SLA, DLP and LCD printers for water debinding and with low decomposition temperature 
  • orange finishing unless your chosen color is added online
  • ideal for direct printing of ultra high temperature resistant Polyimide with temperature resistance up to 350ºC without the need of pressure as conventional hot compression moulding
  • choose LV version for a relatively Low Viscosity for printing without heated printers or below 25ºC
  • choose HV version for relatively High Viscosity version for printing with heated printers or above 25ºC, for overall improved durability  and mechanical properties
  • water/chemical and low temperature debinding and sintering at 360ºC
  • excellent chemical resistance to most chemicals, including strong oxidizing and reducing agents and strong acids and alkalis
  • very high mechanical strength
  • very high impact resistance
  • very high creep resistance even at elevated temperatures
  • low friction coefficient <0.2 for reduced abrasion
  • high resolution up to 20 microns
  • controlled reproducible and isotropic shrinkage after sintering
    • shrinkage % depends of product version and % PI powder concentration which depends on printer specifications and printing temperature
  • printable by SLA, DLP & LCD 3D printers
  • debinding and sintering need to be tuned by customers to their specs

Typical properties after sintering

  • Tensile modulus 360 MPa ISO 527-1/-2
  • Stress at break 140 MPa ISO 527-1/-2
  • Strain at break <10% ISO 527-1/-2
  • Tensile creep modulus, 1h 3400 MPa ISO 899-1
  • Tensile creep modulus,1000h 2700 MPa ISO 899-1
  • Charpy impact strength, +23°C 122C kJ/m² ISO 179/1eU
  • Charpy notched impact strength, +23°C 7C kJ/m² ISO 179/1eA
  • Shore D hardness,15s 90 ISO 7619-1
  • Glass transition temperature, 10°C/min 335-340ºC ISO 11357-1/-2
  • Temp. of deflection under load, 1.80 MPa 320°C ISO 75-1/-2
  • Temp. of deflection under load, 0.45 MPa 340°C ISO 75-1/-2
  • Coeff. of linear therm. expansion, parallel 41 E-6/K ISO 11359-1/-2
  • Relative permittivity, 100Hz 3.5 IEC 62631-2-1
  • Relative permittivity, 1MHz 3.4 IEC 62631-2-1
  • Dissipation factor, 1MHz 80 E-4 IEC 62631-2-1
  • Volume resistivity>1E13 Ohm*m IEC 62631-3-1
  • Electric strength 34 kV/mm IEC 60243-1
  • Density 1380 kg/m³ ISO 1183

Debinding and sintering*:

  • 1st step: water/chemical debinding and 2nd step: thermal debinding at T=180-220ºC 
    • part of the binder has higher decomposition temperature than T=180-220ºC   but exhibits good water solubility for fast debinding and oxidises into small volatile molecules with oxidizers e.g. Potassium permanganate acidic water solutions
    • part of the binder has low decomposition temperature c.180-220C, which is ideal for relatively low temperature debinding
    • the overall binder system exhibits very fast debinding with water at room and at relatively low debinding temperature c.180-220ºC 
  • 3rd step: sintering at 350-380ºC to yield pure sintered polyimide materials

*Note: the final debinding and sintering cycle needs to be custom designed by customers to meet their process specifications; including their optimum debinding and sintering time, wihch depends on the thickness of prints, etc.