3Dresyn Polyimide SPI1 has these features and benefits:
- Sinterable Polyimide PI 3D resin binder printable with SLA, DLP and LCD printers for water debinding and with low decomposition temperature
- orange finishing unless your chosen color is added online
- ideal for direct printing of ultra high temperature resistant Polyimide with temperature resistance up to 350ºC without the need of pressure as conventional hot compression moulding
- choose LV version for a relatively Low Viscosity for printing without heated printers or below 25ºC
- choose HV version for relatively High Viscosity version for printing with heated printers or above 25ºC, for overall improved durability and mechanical properties
- water/chemical and low temperature debinding and sintering at 360ºC
- excellent chemical resistance to most chemicals, including strong oxidizing and reducing agents and strong acids and alkalis
- very high mechanical strength
- very high impact resistance
- very high creep resistance even at elevated temperatures
- low friction coefficient <0.2 for reduced abrasion
- high resolution up to 20 microns
- controlled reproducible and isotropic shrinkage after sintering
- shrinkage % depends of product version and % PI powder concentration which depends on printer specifications and printing temperature
- printable by SLA, DLP & LCD 3D printers
- debinding and sintering need to be tuned by customers to their specs
Typical properties after sintering
- Tensile modulus 360 MPa ISO 527-1/-2
- Stress at break 140 MPa ISO 527-1/-2
- Strain at break <10% ISO 527-1/-2
- Tensile creep modulus, 1h 3400 MPa ISO 899-1
- Tensile creep modulus,1000h 2700 MPa ISO 899-1
- Charpy impact strength, +23°C 122C kJ/m² ISO 179/1eU
- Charpy notched impact strength, +23°C 7C kJ/m² ISO 179/1eA
- Shore D hardness,15s 90 ISO 7619-1
- Glass transition temperature, 10°C/min 335-340ºC ISO 11357-1/-2
- Temp. of deflection under load, 1.80 MPa 320°C ISO 75-1/-2
- Temp. of deflection under load, 0.45 MPa 340°C ISO 75-1/-2
- Coeff. of linear therm. expansion, parallel 41 E-6/K ISO 11359-1/-2
- Relative permittivity, 100Hz 3.5 IEC 62631-2-1
- Relative permittivity, 1MHz 3.4 IEC 62631-2-1
- Dissipation factor, 1MHz 80 E-4 IEC 62631-2-1
- Volume resistivity>1E13 Ohm*m IEC 62631-3-1
- Electric strength 34 kV/mm IEC 60243-1
- Density 1380 kg/m³ ISO 1183
Debinding and sintering*:
- 1st step: water/chemical debinding and 2nd step: thermal debinding at T=180-220ºC
- part of the binder has higher decomposition temperature than T=180-220ºC but exhibits good water solubility for fast debinding and oxidises into small volatile molecules with oxidizers e.g. Potassium permanganate acidic water solutions
- part of the binder has low decomposition temperature c.180-220C, which is ideal for relatively low temperature debinding
- the overall binder system exhibits very fast debinding with water at room and at relatively low debinding temperature c.180-220ºC
- 3rd step: sintering at 350-380ºC to yield pure sintered polyimide materials
*Note: the final debinding and sintering cycle needs to be custom designed by customers to meet their process specifications; including their optimum debinding and sintering time, wihch depends on the thickness of prints, etc.
