3Dresyn AgNSEK1 is our non soluble electrically conductive silver based 3D resin for 3D printing high conductivity materials for electronics e.g. antennas for IoT applications (HF, UHF), RFID and NFC tags, OLED, OPVs, flexible PCBs, flexible cables, etc...
It is non alcohol/water soluble nor swellable ready to print 3D resin, which has these features:
- Sheet resistance: >0.44 Ohm/square
- Resistivity: >8 micro Ohm.m
- Conductivity: <200 kS/m
Features of 3Dresyn AgNSEK1 part 2*:
- non water soluble nor swellable photoreactive printable conductive 3D resin
- silver color
- Shore hardness D80-90
- tack free finishes after light box postcuring
- tensile strength <40 MPa
- Young modulus 2000-3000 MPa
- flexural strength <30 MPA
- elongation <3%
- printable at thin z layers of 10 microns in high power SLA, DLP printers
*Note: 3Dresyn AgNSEK1 is supplied in 3 parts:
- part 1 contains the silver powder: 3Dresyn AgNSEK1 part 1
- part 2 contains the 3D resin: 3Dresyn AgNSEK1 part 2
- part 3 is Fine Tuner FT1*
Mixing procedure. Add part 1 slowly to part 2 under stirring with a Conn blade rotary mixer (avoid excessive energy to prevent excessive foaming and gelation). Alternatively, a vortex mixer can also be used. After full addition and mixing of part 1 in part 2, add part 3* and mix until full homogenization.
IMPORTANT: The product once mixed has a short shelf life, specially if kept at >40-50ºC. If stored in a fridge its shelf life can be extended longer. It is recommended that the product is printed after its mixing to avoid any premature gelation. Conductive products are made to order. Their lead time is around 1-2 weeks.
*Note: The dosage of FT1 depends on the chosen printing settings and printer specifications. Add it in increasing steps of eg 0.2% following our online Instructions for Use IFU. After placing your order request our more detailed Instructions for Use "IFU" for your specific SLA, DLP & LCD printer technology: info@3dresyns.com
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