3Dresyn AgNSEK1 is our non soluble electrically conductive silver based 3D resin for 3D printing high conductivity materials for electronics e.g. antennas for IoT applications (HF, UHF), RFID and NFC tags, OLED, OPVs, flexible PCBs, flexible cables, etc...
It is non alcohol/water soluble nor swellable ready to print 3D resin, which has these features:
- sintering/curing T=120-140ºC (the higher the sintering temperature the lower the resistivity) for 5-10 minutes after 3D printing
- Sheet resistance <0.42-0.44 Ohm/square
- Resistivity <6-8 micro Ohm.m
- Conductivity: >100-200 kS/m
- Silver content: 80% by weight
Features of 3Dresyn AgNSEK1*:
- 3Dresyn AgNSEK1 (non water soluble) and 3Dresyn AgSEK1 (water soluble) can be blended to adjust water resistance and solubility as you wish
- water solubility and swelling can be adjusted with our Soluble & Swellable Electrically Conductive 3Dresyn AgSEK1
- water resistance can be custom increased with 1-15% 3Dresyn XL1
- non water soluble nor swellable photoreactive printable 3d resin
- excellent water absorptivity for adjusting conductivity as you wish
- water can be added before and/or after 3D printing
- soluble salts dissolved in water can be used for increasing conductivity
- silver green brown color
- ultra hard and tough UHT, Shore Hardness D80-85
- tack free finishes after light box postcuring
- high tensile strength >40 MPa
- high rigidity (Young modulus >2200 MPa)
- non brittle, flexural strength >30 MPA
- elongation <7%
- printable at thin z layers of 10 microns in high power SLA, DLP printers
- ideal for printing water soluble mandrels for Electroforming for replacing the expensive multi step prior electrodeposition / electroplating.
*Note: conductivity of 3D printed parts will depend on several variables, such as the dosage of Fine Tuner FT1 and LB1 Bio and the sintering/curing cycle used. LCD 3D printers may exhibit printability limitations due to their low light power