3Dresyn AgNSEK1 is our non soluble electrically conductive silver based 3D resin for 3D printing high conductivity materials for electronics such as antennas for IoT applications (HF, UHF), RFID and NFC tags, OLED, OPVs, flexible PCBs and flexible cables.
It is a non alcohol/water soluble nor swellable ready to print 3D resin designed for conductive printing workflows requiring tack free finishes after postcuring and electrically conductive performance.
Designed for conductive vat photopolymerization workflows in SLA, DLP and LCD 3D printing for manufacturing electrically conductive materials and components for electronics applications.
Low power printers may exhibit printability limitations at high Z layers. In such cases reduce Z layer thickness and increase exposure times accordingly following the Instructions for Use IFU. Final conductivity, printability and processing stability depend on printer power, layer thickness, exposure conditions, mixing quality and storage conditions, and must be validated by the user.
This material is supplied as a professional manufacturing material and is not marketed as a finished medical device. Final part performance and suitability must be validated by the user according to the intended application.
Use these related 3Dresyns pages to navigate adjacent material and process routes within the same technical workflow.
This technical datasheet should be used together with the relevant processing, calibration, safety and workflow documentation available in the 3Dresyns® Resources section.
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