3Dresyn NMF-HF1 has these features and benefits:
- UV & EB curable organic hard & flexible photopolymer for nano and micro fabrication, such as printing of hard & flexible stamps for Nano Imprinting lithography NIL and for hard & flexible negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
- resin with properties in between quartz glass and PDMS
- resin with properties in between 3Dresyn NMF-PDMS-like and 3Dresyn NMF-Glass-like
- UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
- Electron beam EB curable
- compatible and blendable with our 3Dreyns for nano & micro fabrication
- Shore hardness D70
- biocompatible, ultra safe without any toxic pictograms
- medium tensile and flexural strength <30 MPa
- hard and flexible (Young modulus <1000 MPa)
- elongation <50%
- imprint Temperature > 160ºC (short term)
- synthetic resin source
- durable
- very high impact/shattering resistance
- low viscosity <1000 mPas
- excellent balance of low viscosity for easy imprinting and low penetration
- high refractive index 1.45-1.55
- very high resolution (printing resolution of less than 10 nm)
- very low shrinkage <0.5%
- also printable by most commercial and professional SLA, DLP & LCD 3D printers
- organo-tin free
- high optical clarity
- high durability, non degradable
- excellent bonding, low risk of debonding
- high mechanical properties, with low risk of cracking
- very low degassing at high vacuum after curing
- low oxygen sensitivity
- high mechanical stability
- long shelf life of 1 year
- excellent spin coating application
- excellent etching with Reactive Ion Etching
- excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
- low penetration
- low surface tension with good release and demolding properties
- 100% organic (free of inorganic materials)
- contains hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
- no thermal treatment is required
- easy processing with standard lithography equipment
- easy removal of uncured resin with ketones, alcohols and esters
Applications
- easy & cost effective transparent tough stamp fabrication, alternative to quartz or electroplated stamps
- ideal for mass sensors based on UV-NIL, ALD and RIE