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3Dresyn NMF-HF1 Hard & Flexible photopolymer for nano and micro fabrication

Regular price 300.00 €

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3Dresyn NMF-HF1 has these features and benefits:

    • UV & EB curable organic hard & flexible photopolymer for nano and micro fabrication, such as printing of hard & flexible stamps for Nano Imprinting lithography NIL and for hard & flexible negative photoresists for standard UV lithography & PCB technology processing, UV patterning of core and cladding
    • resin with properties in between quartz glass and PDMS
    • resin with properties in between 3Dresyn NMF-PDMS-like and 3Dresyn NMF-Glass-like
    • UV curable: excellent photoreactivity at 250-410 nm with minimum energy dosage
    • Electron beam EB curable
    • compatible and blendable with our 3Dreyns for nano & micro fabrication 
    • Shore hardness D70
    • biocompatible, ultra safe without any toxic pictograms
    • medium tensile and flexural strength <30 MPa
    • hard and flexible (Young modulus <1000 MPa)
    • elongation <50%
    • imprint Temperature > 160ºC (short term)
    • synthetic resin source
    • durable
    • very high impact/shattering resistance
    • low viscosity <1000 mPas 
    • excellent balance of low viscosity for easy imprinting and low penetration  
    • high refractive index 1.45-1.55
    • very high resolution (printing resolution of less than 10 nm)
    • very low shrinkage <0.5%
    • also printable by most commercial and professional SLA, DLP & LCD 3D printers
    • organo-tin free
    • high optical clarity
    • high durability, non degradable
    • excellent bonding, low risk of debonding
    • high mechanical properties, with low risk of cracking
    • very low degassing at high vacuum after curing 
    • low oxygen sensitivity
    • high mechanical stability
    • long shelf life of 1 year
    • excellent spin coating application 
    • excellent etching with Reactive Ion Etching
    • excellent stability and chemical resistance to a wide range of wet chemistries used in the clean room
    • low penetration
    • low surface tension with good release and demolding properties
    • 100% organic (free of inorganic materials) 
    • contains hydroxyl groups for bonding release agents, such as perfluorodecyltrichlorosilane (FDTS)
    • no thermal treatment is required
    • easy processing with standard lithography equipment
    • easy removal of uncured resin with ketones, alcohols and esters

    Applications

    • easy & cost effective transparent tough stamp fabrication, alternative to quartz or electroplated stamps
    • ideal for mass sensors based on UV-NIL, ALD and RIE